Staff PCB Designer

TTM Technologies, Inc. – Publicly Traded US Company, NASDAQ (TTMI) – Top-5 Global Printed Circuit Board Manufacturer

About TTM

TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Additional information can be found at

TTM is an advanced-technology leader in highly sophisticated surveillance, communications, analysis and integration solutions. Our systems are deployed across a wide range of land, sea and air applications, providing our aerospace, defense and commercial customers with a distinct tactical advantage. In this role, the PCB Staff Design Engineer will design moderate to complex printed circuit board (PCB) layouts in the domain of Digital, Analog, Power & RF interconnect applications.

This includes responsibility for circuit board layout conceptualization, (CAD application by means of Siemens Xpedition, PAD’s or Cadence Allegro tool sets), detail design activities and value-engineering in support of internal TTM programs. Areas of emphasis/focus include physical design (CAD implementation)/documentation utilizing best practice of electrical IPC standards/methodologies with experienced approach to manufacturing and sustaining maintenance of legacy design projects. Complementary support provided by a combination of TTM Management, Field Application Engineering, Electrical/Mechanical Engineering and NPI Manufacturing teams.

Must have a background that would permit the U.S. Department of Defense to issue a Secret clearance when necessary for work on a project that requires such a clearance.

• PCB concept sketches for assistance in design layout estimating
• PCB design suggestions/trade-offs regarding initial engineering inputs
• Support changes to existing schematic diagrams using TTM suite of tools:
  OrCAD and/or Dx Designer
• Place and route components ensuring that all electrical and physical specifications meet the detailed design requirements for each PCB design. Utilization of Siemens Xpedition/PAD’s and/or Cadence Allegro required
• Participate in design reviews, interface with electrical, mechanical, manufacturing and process engineers to design proto-type and production printed circuit boards in accordance with TTM standards and quality procedures
• Collaborate on assigned projects closely with Si (Signal Integrity) or various engineering disciplines, fellow designers and Program Leadership
• Provide layout feedback to design engineers as needed to ensure functionality and manufacturability of PCB designs
• Create fabrication and assembly drawings (AutoCAD 2023), parts list & incorporate changes to existing design documentation.
• Create and maintain component libraries
• Generate all output files (ODB++, Bill of Materials & PCB/CCA documentation) required for the manufacture of the board and assembly
• Maintain change (PCN) responsibilities on re-design and documentation updates Industry and TTM-specific electrical standards and methodologies - Product safety and EMI consideration during eCAD layout (UL, CSA, NEBS, Etc.) Standardization of electrical components and eCAD libraries utilizing IPC or vendor specific standards.
• Exceedingly experienced with High-Speed PCB Design Constraints:
  Differential Pairs, Routing Topologies, Controlled Impedance, Length-matched Traces and Delay Tuning Demonstrated experience with RF PCB routing complexities. Implement layout rules for RF transmission lines (Micro-strip & Coplanar Waveguide), signal line isolation practices, via fencing & unique RF routing structures Audio (Analog & Digital separation) PCB best practice layout guidelines highly recommended Direct design experience related to multi-layer CCA and Flex PCB technologies Current knowledge of μ-via/HDI layout methodologies and best practices Understanding of stack-up…