R&D Process Development Engineer

R&D Process Development Engineer

TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market.

TTM Technologies is a leading manufacturer of high-reliability printed circuit boards serving the aerospace, defense, medical device, telecommunications, automotive, and industrial electronics markets. Our manufacturing capabilities span rigid, flex, rigid-flex, HDI, RF/microwave, and advanced multilayer constructions. We are committed to pushing the boundaries of PCB technology through disciplined process development, continuous improvement, and an unwavering dedication to quality and customer satisfaction.

The R&D Process Development Engineer is a highly technical individual contributor responsible for developing, characterizing, optimizing, and scaling advanced manufacturing processes associated with Semi-Additive Plating (SAP) build up technology. Familiarity with Semi-Conductor or Fan-Out Wafer Level Packaging FOWLP process techniques is a plus as line and space characteristics are approaching historic Integrated Circuit sizes. Need for R&D engineering across four critical PCB fabrication disciplines:
Mechanical Processing, Lithography, Electroplating, and Etching. This role sits at the intersection of materials science, chemistry, precision engineering, and manufacturing — requiring both deep scientific rigor and practical manufacturing instincts.

This individual is expected to be the recognized technical authority within their focus areas — able to think outside of the standard and come up with solutions to complex problems, evaluate and set up new equipment and derive processes around those tools to achieve intended results.

This role requires someone equally comfortable running-controlled experiments in a laboratory and developing processes on small scale production manufacturing equipment— someone who bridges the gap between science and production with clarity, confidence, and technical credibility.

• Semi-Additive (SAP) Build-up Process Development Equipment definition, purchase, setup and qualification for R&D. Develop technology that can be scaled to provide solutions to customers across TTM's markets.

• Education:
  
  Required:
  
  Bachelor of Science in Chemical Engineering, Materials Science, Chemistry, Mechanical Engineering, or closely related discipline.
• Preferred:
  Master or PhD of Science in Chemical Engineering, Materials Science, or Electrical Engineering with a focus on electronic materials or manufacturing.
• Experience:
  
  Required:
  
  3–8 years of hands-on process engineering experience in PCB manufacturing, or a closely related wet chemistry/precision manufacturing environment.
  
  Required:
  
  Direct, hands-on experience with at least two of the four focus areas:
  Mechanical, Lithography, Electroplating, or Etching. Preferred:
  Experience in semiconductor fab or FOWLP.
• Technical Knowledge: SAP:
  Fundamentals of SAP Build up or FOWLP technology including hands on experience. General: SPC, Design of Experiments (DoE), Cpk/Ppk analysis, failure analysis methodologies (SEM/EDS, optical microscopy, ICP-MS, XRF, FTIR), IPC standards (IPC-A-600, IPC-6012, IPC-TM-650, IPC-4552), ERP/MES systems, CAM software (Genesis, CAM
  350), SEMI Standards.

• Primary Setting: PCB manufacturing facility — process engineering laboratory and production floor.
• Chemical Exposure:
  Regular work with hazardous chemicals including strong acids (H₂SO₄, HCl, HNO₃, HF), alkalis, copper sulfate, formaldehyde, photoresist chemicals, etchants, and plating bath additives.
• PPE
  
  Required:
  
  Chemical-resistant gloves, safety glasses/face shield, lab coat, acid-resistant apron, and additional PPE as required by SDS and EHS protocols.
• Physical Requirements:
  
  Ability to stand for extended periods; lift and carry up…