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Lead Hardware Subsystems Engineer

Job in El Segundo, Los Angeles County, California, 90245, USA
Listing for: Boeing
Full Time position
Listed on 2026-07-14
Job specializations:
  • Engineering
    Systems Engineer, Electronics Engineer, Electrical Engineering, Aerospace / Aviation / Avionics
Salary/Wage Range or Industry Benchmark: 140000 - 180000 USD Yearly USD 140000.00 180000.00 YEAR
Job Description & How to Apply Below

Lead Hardware Subsystems Engineer

At Boeing, the Boeing Defense, Space & Security (BDS) team is seeking a Lead Hardware Subsystems Engineer to work in El Segundo, CA. Boeing's SI&WS manages the company’s major commercial and government satellite and ground programs for communications, national defense, and other missions.

The position is expected to be 100% onsite. The selected candidate will be required to work onsite at the El Segundo, CA location.

Position Responsibilities
  • Lead work with customers to develop and document complex electronic and electrical system requirements.
  • Oversee the design and build of multiple satellite and avionics units.
  • Lead and coordinate work to analyze and translate requirements into system architecture, hardware and software designs, and interface specifications.
  • Lead work to test and validate to ensure system designs meet operational and functional requirements.
  • Oversee the team that monitors supplier performance to ensure system integration and compliance with requirements.
  • Solve problems concerning and provide support of fielded hardware and software over the entire product lifecycle.
  • Research technology advances for potential application to company business needs.
  • Make recommendations for technology investments.
Basic Qualifications
  • Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical, Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry, or a non‑US equivalent qualification directly related to the work statement.
  • Experience in RF/Digital engineering.
Preferred Qualifications
  • 10 or more years of experience in RF/Microwave engineering.
  • Experience with digital circuit design.
  • Knowledge of FPGAs/ASICs.
  • System engineering experience.
  • Master of Science in Engineering.
  • Prior Aerospace experience.
  • Active TS/SCI clearance.
Conflict of Interest

Successful candidate for this job must satisfy the Company’s Conflict of Interest (COI) assessment process.

Relocation

This position offers relocation based on candidate eligibility. Basic relocation will be offered for eligible internal candidates.

Drug Free Workplace

Boeing is a Drug Free Workplace where post‑offer applicants and employees who meet the criteria are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol.

Shift

1st shift.

Security Clearance

Requires the ability to obtain a U.S. Security Clearance. An interim and/or final U.S. Top Secret/SCI clearance post‑start is required.

Export Control Requirements

Must meet U.S. export control compliance requirements. A “U.S. Person” as defined by 22 C.F.R. 120.62 includes U.S. Citizen, U.S. National, lawful permanent resident, refugee, or asylee.

Education

Bachelor’s Degree or equivalent required.

Visa Sponsorship

Employer will not sponsor applicants for employment visa status.

Equal Opportunity Employer

Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.

Final date to receive applications

Applications for this position will be accepted until Jul. 25, 2026.

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