Sr Principal Engineer Microelectronic Semiconductors Security Clearance

Position: Sr Principal Engineer Microelectronic Semiconductors with Security Clearance
RELOCATION ASSISTANCE:
No relocation assistance available CLEARANCE REQUIRED FOR START:
No CLEARANCE TYPE:
None TRAVEL:
Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman is seeking a Principal Engineer Microelectronic Semiconductors/Sr Principal Engineer Microelectronic Semiconductors 3/4, Manufacturing Engineer: at our Mission Systems Sector in Elkridge, MD. The qualified candidate will become part of Northrop Grumman's Manufacturing organization. The selected candidate will work in a fast paced environment where he/she will interact with multiple disciplines. Process Development
* Developing new and maintaining, or improving, existing manufacturing processes with a focus on production capabilities and affordability

* Providing ROI justification for process improvements

* Specifying, identifying and procuring new manufacturing equipment for production readiness and preparing equipment for production

* Developing/revising process documentation and work instructions

* Be able to take lessons learned and incorporate them into today's process development Factory Support
* Support manufacturing of micro electronics including:
Die, BGAs and interposers.

* Lead and monitor builds as they work down the line. Report out on progress and continuous improvement.

* Monitoring process yields and cost, recommending and implementing quality improvements to drive improved metrics.

* Solving of manufacturing problems (related to materials, designs, equipment and tooling, training and instructions) to support production.

* Assisting with the training of new personnel and participation in the design of operation training materials

* Supporting factory maintenance personnel with the troubleshooting and repair of process equipment

* Helping build team meet the requirements of J-STD-001, internal requirements, and other relevant IPC/MIL-STDs. Design and Engineering Support:
* Recommending product design improvements required to produce advanced microelectronics products.

* Documenting state-of-the-art process capabilities and guidelines for product designers

* Participating in design producibility reviews for new products

* Lead development activities for new cutting edge products with new manufacturing processes.
This position can be filled at either a level 3 or level
4. Basic Qualifications Level 3:
* Bachelors degree in a STEM major and 5+ years relevant manufacturing circuit card assembly environment, or Masters degree and 3+ years relevant manufacturing circuit card assembly environment experience.

* Ability to obtain and maintain a U.S. Government security clearance

* U.S. citizenship Basic Qualifications for level 4:
* Bachelors degree in a STEM major and 8+ years of relevant manufacturing circuit card assembly environment, or Masters degree and 6+ years relevant manufacturing circuit card assembly environment.

* Ability to obtain and maintain a U.S. Government security clearance

* U.S. citizenship

Preferred Qualifications:

* Experience using J-STD-001 and IPC/MIL-STDs standards in manufacturing.

* Familiarity with Fuzion and Mycronic Pick and Place Machines, Screen Printers, SPI concepts and X-Ray.

* Desirable to be skilled in component packaging requirements.

* Demonstrate engineering leadership & teamwork capabilities, interpersonal communication skills, and activities (professional/community/extracurricular)

* Experience in developing and delivering presentations and leading small and large groups

* Experience in working on business or engineering full life-cycle projects from inception through launch.

* Experience working through root cause and corrective action activities.

* Demonstrate engineering technical leadership in a field.

* Experience in working in an autonomous work environment on complex projects.

* Experience in a PCCB process culture

* Successful track record of mentorship and guidance of early career engineers MANUMS #MPR Primary Level Salary Range: $ - $ Secondary Level Salary Range: $ - $ The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current…