ElectroMechanical Packaging Engineer III

Job Title

Electronics Packaging Engineer – D5 Life Extension II program, avionics enclosure design and analysis.

The position does not support teleworking. The selected candidate will be located near the Lockheed Martin Space facility in Littleton or Englewood, Colorado, and be expected to work a flexible 9x80 schedule full‑time. The schedule includes 9x80 with every other Friday off.

• Electronics packaging engineer for space flight applications, including Geometric Dimensioning and Tolerancing (GD&T) and CREO and/or Pro‑E CAD design.
• Create 3D solid models in CREO of space flight avionics and power hardware.
• Perform electronic packaging design and provide technical data for informal and formal Design Review documentation and presentations.
• Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs.
• Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
• Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.
• Deliver producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment.
• Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.

• 3+ years of professional experience in electronics packaging for space flight applications.
• Experience with the full product life cycle and hardware design coordination and execution.
• Knowledge of design requirements definition, interpretation, and implementation.
• Experience with GEOMETRIC DESIGN AND TOLERANCING (GD&T).
• Capable of supporting technical design review preparation.
• Bachelor of Science or higher in Mechanical Engineering or related discipline, or equivalent experience/combined education.
• Experience in electro‑mechanical packaging/enclosure design.
• Working knowledge of CREO CAD modeling.
• Ability to obtain and maintain a DoD Secret clearance; US citizenship required.

• Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.).
• Experience with 3D printing/prototyping.
• Experience with CREO CAD modeling and Zuken.
• Missile/Aerospace related experience.
• Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint).
• Excellent communication, presentation and interpersonal skills with technical and non‑technical audiences.
• Hands‑on hardware experience.
• Experience with subcontracted hardware suppliers.
• Experience performing tolerance stack‑ups.
• Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines.

DoD Secret clearance required; US citizenship mandatory.

The annual base salary range for this position in California, Massachusetts, New York (excluding major metropolitan areas), Colorado, Hawaii, Illinois, Maryland, Minnesota, New Jersey, Vermont, Washington or Washington, DC is $89,300 – $157,550. Benefits include medical, dental, vision, life insurance, short‑term disability, long‑term disability, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off and holidays. The position is incentive plan eligible.

Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.

The application window will close in 90 days; applicants are encouraged to apply within 5 – 30 days of the requisition posting date to receive optimal consideration.

Experience Level: Experienced Professional
Business Unit: SPACE
Relocation Available:
Possible
Career Area:
Electronics Engineering
Type:
Full‑Time
Shift: First