ElectroMechanical Packaging Engineer III

The Fleet Ballistic Missile Avionics team seeks an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and advance them for flight use.

Onsite at Lockheed Martin Space facility in Littleton or Englewood, CO. This position does not support teleworking and requires a flexible 9x80 schedule in the office full‑time.

• Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design reviews.
• Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs and support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
• Establish specifications for contract assemblers and raw‑material vendors, and interface with Parts Engineering, Quality Assurance, and Purchasing regarding material quality and vendor performance.
• Provide producible designs that meet technical, cost, and schedule requirements within an Integrated Product Team environment.
• Prepare all drawings and documentation needed for fabrication and assembly of the hardware.

• Identify initial physical architecture for the avionics subsystem.
• Assist with R&D trade studies for the Pre‑SRR design phase.
• Define requirements and provide the framework for architecture and interface development throughout the program lifecycle.
• Generate and release design disclosure artifacts, including technical presentations and end‑of‑year reports.
• Work on a cross‑functional team in the development and integration of world‑class avionics systems.
• Develop electronic enclosure designs, performance and test requirements, and conduct stress and thermal analysis.
• Participate in iterative design reviews, Engineering Material Review Board hardware discrepancy decisions, and Failure Review Board as required.
• Resolve test anomalies and support system‑level testing.

• Bachelor of Science or higher from an accredited college in Mechanical, Aerospace Engineering or related discipline, or equivalent experience/combined education.
• 3+ years professional experience with electronic enclosure designs, performance and test requirements, stress and thermal analysis.
• Experience with CCA package design (IDX files, board outlines, connector selection, artwork review, component mounting, cooling techniques).
• Full working knowledge of Geometric Dimensioning and Tolerancing (GD&T).
• CAD modeling and drafting experience (CREO, Solid Works or similar).
• Willing and able to obtain and maintain a DoD Top‑Secret clearance; US Citizenship is required.

• Working knowledge of EPDM tools or equivalent.
• Exposure to DFx principles (Design for Affordability, Design for Manufacturability, etc.).
• Experience with 3D printing/prototyping.
• Missile/Aerospace related experience.
• Proficiency in Microsoft Office (Word, Excel, PowerPoint, MS Project).
• Familiarity with FBM specifications/procedures and partnering with SP/SPF Customer Partners.
• Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web.
• Previous CPE and MRB experience.
• Ability to communicate issues and additional resource needs to leadership.
• Experience with subcontracted hardware suppliers and performing tolerance stack‑ups.
• Exposure to Requalification Activities including MORAs and Supplier Relocations.
• Strong teamwork and collaboration skills with adjacent disciplines.
• Excellent communication, presentation, and interpersonal skills with technical and non‑technical audiences.
• Hands‑on hardware experience.

Top Secret clearance required. US Citizenship is mandatory.

• Medical, Dental, Vision, Life Insurance, Short‑Term and Long‑Term Disability.
• 401(k) match, Flexible Spending Accounts, Employee Assistance Program.
• Education Assistance, Parental Leave, Paid Time Off, Holidays.
• Incentive plan eligibility.

Lockheed Martin is an equal‑opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.