ElectroMechanical Packaging Engineer III

Basic Qualifications

• Bachelor of Science or higher from an accredited college in Mechanical Engineering or related discipline, or equivalent experience/combined education.
• Experience in electro-mechanical packaging/enclosure design.
• Working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
• Ability to obtain and maintain a DoD Secret clearance; thus a US Citizen.

Join us at Lockheed Martin as an Electronics Packaging Engineer for the D5 Life Extension II program for avionics enclosure design and analysis.

Location:

This position does not support teleworking; the selected candidate will be located near our Lockheed Martin Space facility in Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time.

• Electronics packaging engineer for space flight applications, Geometric Dimensioning and Tolerancing (GD&T) and CREO and/or Pro-E CAD design.
• Create 3D solid models in CREO of space flight avionics and power hardware.
• Perform electronic packaging design and provide technical data for informal and formal Design Review documentation and presentations.
• Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs.
• Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
• Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.
• Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment.
• Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.

• Experience with the full product life cycle.
• Knowledge of the definition, interpretation, and implementation of design requirements.
• Coordination and execution of hardware designs.
• Development and integration of hardware for both custom and procured electronic assemblies in accordance with all Lockheed Martin Space engineering process specifications.
• Supported technical design review preparation.
• 3+ years of professional experience.
• While no clearance is needed to start in this position, you will need to obtain and maintain a DoD Secret clearance, thus US Citizenship is required.

• Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.).
• Experience with 3D printing/prototyping.
• Experience with CREO CAD modeling and Zuken.
• Missile/Aerospace related experience.
• Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint).
• Ability to communicate issues and additional resource needs to leadership.
• Experience with subcontracted hardware suppliers.
• Experience performing tolerance stack-ups.
• Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines.
• Excellent communication, presentation and interpersonal skills with technical and non-technical audiences including design reviews (SRR, PDR, CDR, etc.).
• Hands-on hardware experience.
• Active security clearance.