VP of Mechanical Engineering

NAVXCOM is a space technology company developing advanced navigation, communication, and computing infrastructure for lunar, martian, and deep-space missions. Our mission is to enable reliable, secure, and cost-effective space operations. While our primary focus is the Space & Defense domain, our software‑defined architectures are built for any environment where failure is not an option—from autonomous deep‑sea vehicles to critical industrial control systems.

NAVXCOM is seeking a strategic Vice President of Mechanical Engineering to architect the physical structures, mechanisms, and thermal management systems of our deployment platforms. You will lead the development of the mechanical architecture that houses our avionics, protects our systems, and enables physical mobility and deployment in the harsh environment of space.

This is not a traditional manufacturing role; this is a high‑reliability aerospace hardware role. You will bridge the gap between high‑level mission requirements and physical, fabricated parts. You will define the mechanical engineering culture, selecting the CAD and FEA tools (e.g., Solid Works, Siemens NX, ANSYS), driving material selection (balancing lightweight composites with ruggedized alloys), and establishing the testing methodologies that ensure our hardware survives launch vibrations and the unforgiving thermal realities of deep space.

In this early stage, you must be willing to roll up your sleeves and execute low‑level, day‑to‑day electrical design and project management tasks from initiation to closeout. You will be actively designing electrical systems, capturing schematics, and laying out boards yourself until funding is secured and a dedicated engineering team can be built.

Note:
This position is currently unpaid until funding is secured. High‑value equity compensation is provided as a Co‑Founder/Executive level partner.

• Hardware for the Cosmos:
  Your boards and systems will operate beyond Earth's atmosphere.
• Architectural Freedom:
  You aren't reverse‑engineering legacy hardware; you are defining the electrical architecture from a blank slate.
• High‑Stakes Engineering:
  You will solve complex problems where thermal management, radiation, strict power budgets, and physics all collide.

• Define the end‑to‑end mechanical architecture: from structural chassis and protective enclosures to complex deployable mechanisms (e.g., antennas, solar arrays).
• Architect the physical structures and mobility systems for our exploration rovers and the ruggedized housings for our ground/orbital central communication terminals.
• Develop the strategy for material selection and manufacturing, optimizing for mass, strength, out gassing properties, and thermal conductivity in space environments.

• Directly design, execute, and oversee 3D CAD modeling, drafting (GD&T), and the fabrication/machining pipeline for all internal hardware.
• Perform low‑level, hands‑on structural (FEA) and thermal (CFD) simulations to ensure the hardware can survive extreme launch loads and orbital thermal cycling.
• Manage rapid prototyping efforts, leveraging CNC machining, 3D printing, and iterative design cycles to validate concepts before flight‑model production.

• Work closely with other departments (Electrical, Software, Quality, and GNC) to seamlessly package electronics, route cabling safely, and ensure physical sensors (cameras, IMUs) are mounted to exact tolerances.
• Collaborate with Electrical Engineering to design critical thermal management pathways that dissipate heat from high‑power avionics and computing modules in a vacuum.

• Develop robust, ruggedized structures that allow the spacecraft and rovers to survive impact, dust mitigation, and localized hardware stress.
• Apply these highly durable mechanical principles to terrestrial markets, such as high‑pressure deep‑sea robotics, automotive safety systems, or remote industrial enclosures.

• Recruit and mentor a team of mechanical engineers, CAD designers, thermal specialists, and test…