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Principal Development Engineer

Job in Erie, Erie County, Pennsylvania, 16501, USA
Listing for: Foxconn Interconnect Technology (FIT)
Full Time position
Listed on 2026-09-25
Job specializations:
  • Engineering
    Manufacturing Engineer, Product Engineer, Electrical Engineering, Mechanical Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 160000 USD Yearly USD 120000.00 160000.00 YEAR
Job Description & How to Apply Below

Job Title:
Product Development Engineer, Senior/ Principal

Background:

Seeking a versatile and skilled Product Development Engineer with a strong background in connector and cable assembly design. The role involves active engagement in the development of a wide range of products, including high-speed connectors and cable assemblies, catering to diverse applications.

Job function and expertise preferred:

  • Lead in the design and development of a variety of products, including high-speed connectors and cable assemblies. Ensure that these products meet customer expectations in terms of performance, quality, and adherence to deadlines and budgets.
  • Conduct force, structural, and tolerance analyses using advanced simulation tools such as ANSYS.
  • Create in Solidworks comprehensive product and customer drawings, 3D models, and customer view models, following strict DFM (Design for Manufacturing) guidelines in various manufacturing processes.
  • Plan and execute Design of Experiments (DOEs) after CAD/prototype completion. Manage product development through engineering stages to maintain project milestones.
  • Act as a technical lead, working closely with cross-functional teams, including SI, Manufacturing, PM, and Sales. Provide essential technical support and perform engineering analyses and testing.
  • Work with global manufacturing resources and suppliers, and effectively coordinate with teams across different regions and time zones. Be available for global communication as needed.
  • Work with Signal integrity and Manufacturing groups to make critical product tradeoff decisions to find optimal point for SI, Mechanical, and Manufacturing.

Education: MS or BS in Mechanical Engineering

  • Background:
    Minimum 5 years of related experience.
  • Bachelor’s Degree (Mechanical) required, Master’s preferred.
  • Capable of using design software and design methodologies (CREO, PDMLink, ANSYS, & Tolerance Analysis, etc.).
  • Advanced knowledge of manufacturing process (Machining, Molding, Stamping, Plating, Cable, etc.).
  • Working knowledge of signal integrity concepts is a plus
  • Experience in connector design: common mating interfaces, materials, industry standards, wipe distances, normal forces, etc.
  • Knowledge of material (metal/plastic) properties and industry standards.
  • Product development for the datacenter or communication market and familiarity with quality tools (FMEA, Six Sigma, DOE, 8D), is a plus!
  • This position is highly technical and requires an individual who can work independently

Foxconn Interconnect Technology, Inc. (“FIT”) focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products.

We offer our employees competitive compensation and world class benefits. In addition, we recognize the performance of the company, business unit and individual through our incentive and recognition programs. At FIT, base pay is one part of our total compensation package. Individual pay is determined by several factors including but not limited to geography, job related knowledge, skills, experience, and relevant education and/or training.

FIT is an equal opportunity employer Minorities/Females/Protected Veterans/Disabled

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