SMTS - 3D Heterogenous integration Engineer 5D interposer​/bridge​/DTC

SMTS - 3D Heterogenous integration Engineer - 2.5D interposer/bridge/DTC page is loaded## SMTS - 3D Heterogenous integration Engineer - 2.5D interposer/bridge/DTClocations:
Essex Junction time type:
Full time posted on:
Posted Todayjob requisition :
JR-2601234
** About Global Foundries:
** Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit
** Summary of Role:
** Global Foundries Advanced Packaging Lab is seeking an accomplished engineer with extensive expertise in chiplet-based system integration, specifically within 2.5D interposer/bridge and 3D heterogeneous integration technologies. This senior technical position entails end-to-end integration responsibility for advanced heterogeneous solutions, encompassing silicon, glass, and mold interposers as well as embedded silicon bridge architectures.
*
* Essential Responsibilities:

*** Lead 2.5D/3D advanced packaging technology platforms (e.g. silicone/glass/mold interposer, silicon bridge, deep trench capacitor, etc.) integration strategy and readiness, including interface requirements and co-optimization with fabrication and assembly constraints.
* Partner with cross-functional teams such as unit process engineers, modeling engineers, manufacturing engineers, as well as directly with the tool and material vendors for the Global Foundries fabs.
* Collaborate joint development projects with partners to develop 2.5D/3D Heterogeneous Integration processes and to provide timely updates on schedule and deliverables
* Drive end-to-end process integration, interpretation of results and planning to enable new capabilities and early product prototyping across multiple programs.
* Own integration risk assessment and develop reliability strategy; drive root-cause investigation of failure modes through failure analysis and structured design of experiment.
* Promote technical innovation via patents, internal publications, and robust integration methodologies for 2.5D/3D heterogeneous integration—including silicon/glass interposer, silicon bridge, advanced interconnects, and comprehensive integration control and metrology.
*
* Other Responsibilities:

*** Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
* Participate in hiring activities.
* Mentor and guide new hires to assume their roles and responsibilities.
* Other duties as assigned by manager.
*
* Required Qualifications:

*** Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or related field from an accredited degree program.
* MS degree with at least 10 years of prior related work experience.
* In-depth knowledge of BEOL processes and advanced packaging integration, including RDL/UBM metallization, wafer thinning/backside processing, wafer test/probe, OSAT collaboration, and package development & assembly.
* Strong problem-solving and technical troubleshooting skills, including expertise in design of experiment, statistical analysis, and yield/reliability learning.
* Demonstrated record of technical leadership, strong execution, and ability to influence across functions (fab, design, product engineering, reliability, and external partners).
* Language Fluency - English (Written & Verbal).
* Travel - Up to 10%.
*
* Preferred Qualifications:

*** Education – PhD education level preferred with at least 8 years of prior related work experience.
* Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
* Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
* Strong written and verbal communication skills.
* Strong planning & organizational skills.
** Expected Salary Range**$ - $The exact Salary…