Packaging Integration Engineer

## Packaging Integration Engineer Apply locations:
Essex Junctionposted on:
Posted Todayjob requisition :
JR-2604985
** About Global Foundries
** Global Foundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit
** Summary of Role
** As a Packaging Engineer within GF’s Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.
** Essential

Responsibilities include:

*** Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
* Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
* Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
* Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
* Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
* Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
* Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.
* Present technical updates and roadmaps to internal stakeholders and external partners.
** Other Responsibilities
*** Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
* Travel up to 25% to other Global Foundries facilities or external partner sites may be necessary.
** Required Qualifications
*** Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering or related field.
* 8+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
* Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
* Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.
* Understanding of reliability standards and qualification methodologies for optical modules.
* Excellent analytical, problem-solving, and communication skills.
* Experience in bringing packaged products from development into production.
* Strong written and spoken English communication skills.
** Preferred Qualifications
*** Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).
* Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.
* Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
* Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL).
* Familiarity with GF’s FotonixTM platform, including 300mm monolithic SiPh integration and advanced packaging flows.
* Experience working with OSATs and managing external development partners.
* Demonstrated ability to lead cross-functional teams and influence technical direction.
** Expected Salary Range**$ - $The exact Salary will be determined based on qualifications, experience and location.

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