Packaging Integration Engineer; College Graduate

Position: Packaging Integration Engineer (2026 New College Graduate)
## Packaging Integration Engineer (2026 New College Graduate)
Apply locations:
Essex Junction time type:
Full time posted on:
Posted Todayjob requisition :
JR-2603869
** About Global Foundries
** Global Foundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit
** New College Graduates Overview
** We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.
** Summary of Role
** Global Foundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. In this role, you will collaborate with cross-functional engineering teams to support the development and manufacturing of electro-optical transceivers utilizing GF’s Photonix platform and advanced 2.5D/3D packaging technologies.

The engineer will contribute to package integration, process development, reliability characterization, and data analysis activities while gaining hands-on experience in advanced semiconductor packaging technologies. This position offers an opportunity to work alongside experienced engineers and develop technical expertise in silicon photonics, assembly processes, and next-generation packaging solutions.
** Essential

Responsibilities include:

*** Support assembly process integration activities for silicon photonics and advanced packaging products.
* Assist with process development, characterization, and qualification activities for new package technologies.
* Analyze engineering and manufacturing data to identify process improvement opportunities.
* Participate in failure analysis and root cause investigations for packaging and assembly-related issues.
* Support package reliability testing and characterization activities.
* Collaborate with design, product, manufacturing, quality, and supplier teams to address technical challenges.
* Contribute to design rule development and manufacturability assessments for new products.
* Document experimental results and communicate findings through presentations and technical reports.
* Participate in continuous improvement initiatives focused on yield, quality, cost, and reliability.
** Other Responsibilities
*** Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
* Travel up to 10% to other Global Foundries facilities may be necessary. HM to confirm whether this should remain in posting.
** Required Qualifications
*** Education – Graduating with a Bachelors, Master’s, or PhD degree in Materials Science Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related STEM discipline from an accredited degree program. HM to confirm final education level and majors.
* Must have at least an overall 3.0 GPA and proven good academic standing.
* Basic understanding of semiconductor packaging, silicon photonics, materials science, reliability, manufacturing processes, or related technologies gained through coursework, research, internships, co-ops, or academic projects.
* Demonstrated analytical and problem-solving skills.
* Experience analyzing experimental or engineering data.
* Ability to work effectively within cross-functional teams.
* Language Fluency - English (Written & Verbal).
* Travel - Up to 10%.
** Preferred Qualifications
*** Prior related internship, co-op, research, or academic project experience in semiconductor packaging, silicon photonics, reliability engineering, failure analysis, materials characterization, thermal or mechanical simulation, or…