Member of Technical Staff - Integration Engineering

As a Process Integration Engineer focusing on BEOL (Back End of Line) you will be part of the BEOL Integration department, participating in developing, maintaining and improving advanced high-volume manufacturing technologies in GF's state-of-the-art 200mm wafer fab (Fab9) in Essex, VT. Additionally, process transfer and integration module development activities are part of our job. Reporting to the Fab9 Process Integration management, the primary responsibility of this position is to manage the BEOL part of an integrated CMOS process flow, drive improvements to enhance reliability, yield and manufacturability of this flow.

This role is daytime hours, Monday through Friday, fully onsite.
** Summary of Role:*
* *
* Essential Responsibilities:

** - Lead and coordinate a team of up to 5 staff to assess risk and execute tasks to achieve the objective
* Collaborate with technology development and process module teams to implement best practices into new technologies during development and qualification
* Identify, resolve, and improve process integration issues and related problems
* Perform project management and data analysis
* Work with cross function teams to resolve technical & yield concerns
* Develop and improve test structures that enable fast and rigorous characterization of process
* Drive CIP (Continuous improvement plans) to deliver organizational goals
* Work and collaborate other projects and/or assignments as needed
*
* Other Responsibilities:

** Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
* Other duties as assigned by manager / supervisor
*
* Required Qualifications:

**
* Education:

Bachelor of Science degree in Math, Mechanical Engineering, Electrical Engineering, Physics, or a related discipline + 6-7 years of semiconductor engineering manufacturing experience
** OR
* * MS + 5-6 years semiconductor engineering manufacturing experience
** OR
* * PhD + 3-4 years semiconductor engineering manufacturing experience

* Experience:

Prior front end of line process integration experience, and/or MOL and BEOL experience
* Project management skills / team leadership experience - i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity and influence without authority
* Travel - Up to 10%
* Fluency in English Language – both written & verbal
* Ability to work effectively and efficiently with diverse teams
* Strong structured problem-solving skills and experience
* Ability to apply principles of Statistical Process Control (SPC) and Design of Experiments (DOE)
* Strong leadership and communication skills
*
* Preferred Qualifications:

**
* Education:

Master’s degree in science, math, engineering, semiconductor manufacturing, or a related discipline
* Broad understanding of device integration including Aluminum & Copper Interconnect technology, Passive Device structures, and MIM Cap integration.
* Working device physics understanding
* Ability to analyze / characterize PCM and physical data in support of project identification and demonstration of improvement
* Knowledge of Lean Manufacturing principles

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law
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