Packaging Integration Engineer (2026 New College Graduate

About Global Foundries

Global Foundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.

Global Foundries isseekinga highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics teamas a Packaging Integration Engineer. In this role, you will collaborate with cross-functional engineering teams to support the development and manufacturing of electro-optical transceiversutilizingGF’sPhotonixplatform and advanced 2.5D/3D packaging technologies.

The engineer will contribute to package integration, process development, reliability characterization, and data analysis activities while gaining hands-on experience in advanced semiconductor packaging technologies. This position offers an opportunity to work alongside experienced engineers and develop technicalexpertisein silicon photonics, assembly processes, and next-generation packaging solutions.

• Support assembly process integration activities for silicon photonics and advanced packaging products.

• Assist with process development, characterization, and qualification activities for new package technologies.

• Analyze engineering and manufacturing data toidentifyprocess improvement opportunities.

• Participate in failure analysis and root cause investigations for packaging and assembly-related issues.

• Support package reliability testing and characterization activities.

• Collaborate with design, product, manufacturing, quality, and supplier teams to address technical challenges.

• Contribute to design rule development and manufacturability assessments for new products.

• Document experimental results and communicate findings through presentations and technical reports.

• Participate in continuous improvement initiatives focused on yield, quality, cost, and reliability.

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs.

• Travelup to 10% to other Global Foundries facilities may be necessary. HM to confirm whether this should remain in posting.

• Education – Graduating with a Bachelors, Master’s, or PhD degree in Materials Science Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related STEM discipline from an accredited degree program. HM to confirm final education level and majors.

• Must have at least an overall 3.0 GPA and proven good academic standing.

• Basic understanding of semiconductor packaging, silicon photonics, materials science, reliability, manufacturing processes, or related technologies gained through coursework, research, internships, co-ops, or academic projects.

• Demonstrated analytical and problem-solving skills.

• Experience analyzing experimental or engineering data.

• Ability to work effectively within cross-functional teams.

• Language Fluency
  - English (Written & Verbal).

• Travel
  - Up to 10%.

• Prior related internship, co-op, research, or academic project experience in semiconductor packaging, silicon photonics, reliability engineering, failure analysis, materials characterization, thermal or mechanical simulation, or process integration.

• Familiarity with Design of Experiments (DOE) methodologies.

• Experience with statistical data analysis tools.

• Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration.

• Demonstrated prior…