Packaging Design Integration Engineer (2026 New College Graduate

About Global Foundries

Global Foundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.

Global Foundries seeks a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. In this role, you will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies.

The engineer will contribute to thermal, mechanical, electrical, and optical design integration activities, including design rule development, simulation/modeling support, manufacturability assessments, and reliability-focused design characterization. This role offers hands‑on exposure to next‑generation packaging solutions while building technical depth in silicon photonics, advanced packaging design, and engineering analysis.

• Support packaging design integration activities for silicon photonics and advanced packaging products.

• Assist with thermal, mechanical, electrical, and optical chip package co-design analysis under the guidance of experienced engineers.

• Contribute to design rule development, manufacturability assessments, and design review preparation for new package technologies.

• Use engineering data, simulations, and characterization results to help evaluate design options and identify improvement opportunities.

• Participate in cross-functional problem‑solving efforts related to technical, yield, quality, and reliability concerns.

• Support development and documentation of design guidelines, technical reports, and presentation materials.

• Collaborate with design, product, process integration, manufacturing, quality, and supplier teams to support new customer products.

• Participate in continuous improvement initiatives focused on design quality, manufacturability, cost, and reliability.

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

• Travel up to 10% to other Global Foundries facilities may be necessary. HM to confirm whether this should remain in posting.

• Education – Graduating with a Bachelor’s, Master’s, or PhD degree in Mechanical Engineering, Electrical Engineering, Materials Science Engineering, Chemical Engineering, Physics, Optical Engineering, or a related STEM discipline from an accredited degree program. HM to confirm final education level and majors.

• Must have at least an overall 3.0 GPA and proven good academic standing.

• Basic understanding of semiconductor packaging, silicon photonics, chip package co‑design, modeling/simulation, materials science, reliability, or manufacturing processes gained through coursework, research, internships, co‑ops, or academic projects.

• Demonstrated analytical and problem‑solving skills.

• Experience analyzing experimental, simulation, or engineering data.

• Ability to work effectively within cross‑functional teams.

• Language Fluency – English (Written & Verbal).

• Travel – Up to 10%. HM to confirm or remove.

• Prior related internship, co‑op, research, or academic project experience in advanced packaging, silicon photonics, chip package interaction, thermal/mechanical/electrical/optical design, reliability engineering, or process integration.

• Familia…