Packaging Integration Engineer

About Global Foundries

Global Foundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

As a Packaging Engineer within GF’s Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.

• Own the definition, design, and qualification of optical packaging architectures forSiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.

• Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.

• Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).

• Performmultiphysicssimulations (thermal, mechanical, optical) tooptimizepackage performance and reliability.

• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.

• Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.

• Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.

• Present technical updates and roadmaps to internal stakeholders and external partners.

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs.

• Travel up to 25% to other Global Foundries facilitiesor external partner sitesmay be necessary.

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering,Optical Engineeringor related field.

• 8+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.

• Hands-on experience with fiberattachprocesses, photonic alignment, and optical coupling techniques.

• Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.

• Understanding of reliability standards and qualification methodologies for optical modules.

• Excellent analytical, problem-solving, and communication skills.

• Experience in bringing packaged products from development into production.

• Strong written and spoken English communication skills.

• Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).

• Knowledge of co-packaged optics (CPO), pluggable modules, and siliconphotonicsecosystems.

• Expertise in chip package interaction for 2D,2.5D, 3D, 3.5DSiPhadvanced packaging.

• Strong background in thermal/mechanical modeling and optical simulation tools (e.g.,Lumerical, COMSOL).

• Familiarity with GF’sFotonix™ platform, including
  300mmmonolithic
  
  SiPhintegration and advanced packaging flows.

• Experience working with OSATs and managing external development partners.

• Demonstrated ability to lead cross-functional teams and influence technical direction.

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The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at  and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

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