Technical Sales Executive, Hyperscaler Segment

Who We Are

As a global leader in smart, healthy and sustainable buildings, our mission is to reimagine the performance of buildings to serve people, places and the planet. Join a winning team that enables you to build your best future. Within our Stack Forging Thermal Solutions division, we are advancing direct liquid cooling (DLC) for the next generation of AI and high‑density compute infrastructure, specifically designed to meet the massive scale of the world’s largest cloud providers.

• Competitive base salary and commission program tailored for high‑growth hyperscale markets.
• Comprehensive benefits package including 401K, medical, dental and vision care—available day one.
• Work‑life balance: three weeks paid vacation, holidays, sick time and three flex PTO days.
• Growth environment: access to JCI’s global resources with the agility of a specialised technology division.
• Extensive training on Stack Forging Thermal Solutions’ proprietary DLC technologies and JCI’s broader HVAC and chiller ecosystem.

Under general direction you are responsible for the sale of Stack Forging Thermal Solutions Direct Liquid Cooling (DLC) products to the Hyperscaler market segment. You will position Johnson Controls as the primary thermal partner for massive‑scale AI clusters and high‑density compute deployments.

• Execute the sales process: cultivate and manage long‑term relationships within the Hyperscaler ecosystem (Google, AWS, Meta, Microsoft, etc.), seeking out and closing large‑scale production opportunities for Alloy DLC products.
• Technical advisory: support Hyperscaler product architects and thermal engineers in integrating Stack Forging Thermal Solutions technology into custom rack designs to achieve industry‑leading PUE (Power Usage Effectiveness).
• Define solution requirements: work with customers and prospects to collect performance and solution requirements and communicate these to Solutions Engineering and Product teams internally.
• Pipeline management: maintain an accurate pipeline focused on the rapid transition from air‑cooled to liquid‑cooled "mega‑facilities."
• Technical leadership: act as a trusted advisor to Hyperscaler engineering teams, validating that our solutions deliver the thermal overhead required for next‑gen silicon.
• Cross‑functional collaboration: partner with Business Development and Solutions Engineering to ensure seamless deployment across global regions.
• Strategic negotiation: support the negotiation of high‑volume purchase agreements and Master Service Agreements (MSAs) for mass production.

• Persuasive selling: confidently articulate the total cost of ownership (TCO) and performance advantages of Stack Forging Thermal Solution’s DLC offerings at the rack and facility level.
• Relationship building: proactively address Hyperscaler concerns regarding rising TDP (Thermal Design Power) and the physical constraints of traditional data‑center cooling.
• Strategic targeting: navigate complex Hyperscaler organisations to identify key decision‑makers in infrastructure procurement and hardware engineering.
• Solution linking: align Stack Forging Thermal Solution’s efficiency with customers ESG goals, specifically targeting net‑zero water and energy consumption targets.
• Advocacy: act as the customer’s voice internally to ensure Alloy products are optimised for the unique power and space constraints of Hyperscaler environments.

• Required education: bachelor’s, master’s or PhD in mechanical engineering, thermal engineering or a related technical field.
• Experience:
  
  a minimum of three years of successful technical sales experience specifically within the Hyperscaler or large‑scale data‑center segments.
• Technical literacy: strong understanding of heat transfer fundamentals, fluid dynamics and data‑center cooling loops (CDUs, secondary loops).
• Communication: ability to bridge the gap between deep‑dive thermal engineering discussions and executive‑level ROI presentations.

• Specialised knowledge: proven track record selling direct liquid cooling (DLC) or complex thermal management systems to the Hyperscaler/HPC segment.
• Market network: existing high‑level relationships within the Big Six Hyperscalers.
• Advanced experience: five or more years in the data‑center thermal management space with a focus on liquid‑to‑chip technology.

Salary range: $125,000 – $200,000. Salary is determined by education, experience, knowledge, skills and abilities of the applicant, internal equity and alignment with market data. This role also offers a competitive sales incentive plan that takes into account volume and margin on a project, quarterly and annually. If you believe your background warrants consideration beyond the stated range, we encourage you to apply.

For more information, visit the Johnson Controls Careers site at