Sr. Manager, Business Development

About the Role

As part of Johnson Controls, you will help define how next-generation data centers are cooled. This role includes business development, account leadership, and partner / ecosystem strategy. You will drive adoption of direct liquid cooling across hyperscalers, chip makers, and server OEMs while shaping how full-rack and system-level cooling is deployed.

• Competitive base salary with performance-based incentives tied to strategic account growth.
• Comprehensive benefits including 401K, medical, dental, and vision starting day one.
• Paid time off, holidays, and sick leave provided.
• Direct exposure to emerging AI infrastructure programs and next-generation cooling platforms.
• Opportunity to shape commercialization of Stack Forging technology within Johnson Controls’ global footprint.

• Market Development Leadership:
  Own and expand Stack Forging Thermal Solution’s presence in direct liquid cooling across hyperscalers, chip/semiconductor companies, and server OEMs. Focus on large-scale AI and HPC deployments.
• Strategic Account Growth:
  Build and lead executive relationships. Position Stack Forging Thermal Solutions as a primary thermal partner for next-generation platforms, including CPUs, GPUs, other ASICs, and peripheral systems.
• Technology Positioning:
  Translate Stack Forging microgeometry architecture into clear customer value, emphasizing lower pressure drop, higher thermal efficiency, and system-level gains such as improved PUE and rack density.
• DLC System Expansion:
  Drive adoption beyond GPUs into full 100% DLC architectures, including peripherals such as VRMs, DIMMs, NICs, and storage. Position Stack Forging as a platform solution, not a component vendor.
• Program Origination:
  Working with the Technical Sales team, identify and secure early-stage design wins. Influence platform specifications and reference designs with OEM and hyperscale partners.
• Cross-Functional Execution:
  Work closely with engineering, product, and JCI teams to align cold plates, CDUs, and facility-level systems into a unified thermal solution.
• Commercial Structuring:
  Lead complex deal structures including MSAs, long-term supply agreements, and co-development programs tied to production scale.
• Drive DLC Adoption:
  Persuasively sell Alloy’s Direct Liquid Cooling portfolio focusing on ROI, energy efficiency, and power density.
• Strategic Relationship Management:
  Act as a trusted advisor to executive and technical stakeholders, anticipating their needs as they transition to Direct Liquid Cooling.
• Link Performance to Business Outcomes:
  Tie Stack Forging products to measurable gains such as reduced pumping power, improved thermal margins, higher compute density, and lower total cost of ownership.
• Market Leadership:
  Deeply understand the evolving data center landscape, specifically the cooling requirements for AI and high-performance computing (HPC).
• Internal
  
  Collaboration:
  
  Partner with JCI Cross-Domain Strategic Account Managers and the Technical Sales team to integrate our DLC solutions into broader, complex facility infrastructure deals.
• Pipeline Excellence:
  Utilize Salesforce to manage complex, long-cycle sales stages, ensuring accurate forecasting and momentum.
• Team Leadership:
  Lead the opportunity team, coordinating between Technical Sales, Solutions Engineering, JCI Operations, and external partners to ensure seamless solution delivery.

• Bachelor’s degree in Science or related technical field.
• 10+ years in business development, technical sales, or strategic account management.
• Experience scaling products from R&D-to-production in hardware or infrastructure environments.
• Experience engaging with hyperscalers, OEMs, or silicon providers.
• Ability to communicate complex technical concepts to both engineers and executives.

• Master’s degree.
• Experience with in data center infrastructure, semiconductors, or thermal systems and/or direct experience with liquid cooling, including cold plates, CDUs, or immersion systems.
• Familiarity with AI and HPC infrastructure trends, including rising TDP and rack density constraints.
• Proven understanding of Thermal Management or HVAC systems; specific exposure to liquid cooling technologies is highly preferred.
• Existing relationships within hyperscalers, server OEMs, or chip manufacturers.

Salary: $125,000 - $190,000 (with performance-based incentives). This role offers a competitive bonus plan and a comprehensive benefits package.