Member of Technical Staff, AI-optimized Physical​/Platform Architect

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next‑generation, high‑performance memory solutions for AI. In Micron’s AI‑optimized Memory Architecture organization, we partner closely with customers to design and deliver memory solutions purpose‑built for emerging AI systems and applications.

• Architect and specify thermal management, power delivery, and on‑/off‑chip interfaces for high‑performance stacked memories.
• Collaborate with experts across SoC/memory design, memory systems architecture, and advanced packaging to explore tradeoffs and define architectures and requirements.
• Compose and maintain clear architecture documentation that aligns design intent across teams.
• Analyze and reason across several different domains to find optimal cross‑domain solutions.
• Influence decisions through data‑driven systems analysis and clear communication.

• Experience with analog and digital design, including architecture tradeoff analysis, specification development and definition, and prototype design.
• Experience with high‑performance memory devices and memory systems, such as HBM.
• Experience analyzing thermal performance with thermal modelling tools (e.g., Flo Therm).
• Experience with architecture, simulation and design of 2.5D and 3D I/O interfaces on modern foundry nodes.
• Experience with power delivery and thermal architectures, tradeoffs, constraints, and challenges.

• Contributions to physical, thermal and power delivery solutions for stacked architectures.
• Experience with advanced packaging building blocks and techniques.
• Experience with high‑efficiency, stacked SoC and/or DRAM architectures and designs.
• A Master’s or PhD in Computer Science, Computer Engineering, Electrical Engineering, or equivalent experience.
• 5+ years of proven industry experience delivering silicon‑demonstrated SoC hardware designs, stacked memory or logic designs, or complex packaging architectures.

• Systems Design Engineering MTS

Estimated base salary range: $177,000 – $309,000 per year.

Micron offers a comprehensive package of medical, dental, vision, income protection, paid family leave, paid time off, and holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.