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Lead HBM Design Architect Speed Memory Innovation

Job in Folsom, Sacramento County, California, 95630, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-06-03
Job specializations:
  • Engineering
    Systems Engineer, Engineering Design & Technologists
Salary/Wage Range or Industry Benchmark: 150000 - 200000 USD Yearly USD 150000.00 200000.00 YEAR
Job Description & How to Apply Below
Position: Lead HBM Design Architect — High-Speed Memory Innovation

Micron Technology, Inc is seeking a Principal HBM Design Architect to lead the design of high-speed DRAM interfaces for HBM cubes. You will be responsible for command logic and collaborate on full chip testbench development.

The ideal candidate will have extensive experience in DRAM operations, JEDEC specifications, and mixed-signal design, with a strong foundation in problem-solving and collaboration. Join us to innovate and drive next-generation memory solutions!

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