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HBM SIPI, Staff Engineer

Job in Folsom, Sacramento County, California, 95630, USA
Listing for: Micron Technology
Full Time position
Listed on 2026-06-19
Job specializations:
  • Engineering
    Systems Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 200000 - 250000 USD Yearly USD 200000.00 250000.00 YEAR
Job Description & How to Apply Below

SI/PI Engineer in HBM Design Architecture

Micron Technology is seeking an experienced SI/PI Engineer to execute high‑quality SI/PI analysis for interposers, packages, and silicon channels, contributing directly to HBM design sign‑off and product success. The role involves complex, multi‑disciplinary SI/PI initiatives across multiple HBM product generations—including early interposer channel analysis, equalization co‑design, PDN architecture, and system PI analysis—to ensure Micron’s HBM SI/PI architecture remains the industry benchmark for signal quality, power delivery integrity, and interface reliability.

Responsibilities
  • Signal integrity channel analysis for 2.5D and 3D silicon interposer, including frequency‑domain characterization (insertion loss, return loss, PSXT, IL‑to‑XT ratio) and time‑domain analysis (eye diagram, BER, jitter decomposition).
  • Conduct mask‑based timing analysis using time‑domain simulations (e.g., SPICE, ADS).
  • Support power integrity and PDN analysis, including impedance modeling and transient response analysis.
  • Electromagnetic extraction and modeling of signal and power delivery channels (PCB, package, interposers, etc.).
  • Automate sign‑off processes and work with EDA suppliers to improve tool accuracy and analysis flow.
Minimum Qualifications
  • 5 years of experience in signal integrity (SI) and power integrity (PI) modeling and analysis.
  • Deep understanding of SI/PI, electromagnetic and transmission line theory, I/O design.
  • Experience in circuit simulation such as Keysight ADS and Synopsys HSPICE.
Preferred Qualifications
  • 7+ years of experience in signal integrity and power delivery network (PDN) modeling and analysis.
  • Experience in SI/PI modeling and analysis for 2.5D/3D advanced packaging (CoWoS, EMIB, interposer‑based designs), including time‑domain analysis (eye diagram, BER, jitter decomposition, PDN) and frequency‑domain characterization (S‑parameters, PDN impedance).
  • Experience with mask‑based timing budget and jitter analysis with time‑domain simulation (SPICE, ADS, etc.).
  • Experience with high‑speed interfaces such as DDR, HBM, UCIe, PCIe, and SERDES.
  • Proficiency in simulation and analysis using industry‑standard EDA tools, including ANSYS HFSS/SIwave, Keysight ADS, Synopsys HSPICE, Cadence PowerSI/PowerDC.

The US base salary range that Micron Technology estimates it could pay for this full‑time position is: $ - $ a year.

Additional Compensation May Include Benefits, Bonuses and Equity.

As a world leader in the semiconductor industry, Micron offers a comprehensive benefits program to support health, financial security, and work‑life balance, including medical, dental and vision plans, paid family leave, paid time‑off, and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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