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Senior HBM Design Architect Speed Memory Interface

Job in Folsom, Sacramento County, California, 95630, USA
Listing for: 1000 Micron Technology, Inc.
Full Time position
Listed on 2026-06-26
Job specializations:
  • Engineering
    Electronics Engineer, Engineering Design & Technologists
  • Design & Architecture
    Engineering Design & Technologists
Salary/Wage Range or Industry Benchmark: 130000 - 180000 USD Yearly USD 130000.00 180000.00 YEAR
Job Description & How to Apply Below
Position: Senior HBM Design Architect – High-Speed Memory Interface

1000 Micron Technology, Inc. seeks a Member of Technical Staff HBM Design Architect to design high-speed interfaces between DRAM and base die in HBM cubes. You’ll engage in circuit simulations and collaborate on various design aspects while supporting new product development.

The ideal candidate should have extensive experience with DRAMs, particularly in command logic and analog circuit design. Micron offers robust benefits including medical, dental, vision plans, and substantial paid time-off.

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Position Requirements
10+ Years work experience
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