ASIC Engineer

ASIC Engineer

We are seeking an IC Package Design Manager to lead a team of engineers in designing complex flip-chip-BGA packages for industry-leading ASICs. These ASICs are vital for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. As part of a global R&D team, you will develop high-performance package designs featuring high-speed Ser Des, 5G RF/Microwave ADC/DAC, HBM, DDR5, and more.

Your role involves supporting and developing the engineering team, contributing to technical methodologies, and managing projects.

• Lead and manage a team of 6-10 engineers, with potential for team growth.
• Design complex flip-chip-BGA packages for ASICs with high-speed Ser Des and high-power delivery needs.
• Support the worldwide R&D team in developing high-performance package designs.
• Contribute to the development of technical methodologies and project management.
• Manage team and customer activities to ensure projects stay on track.
• Create and track project plans for over 20 concurrent designs, managing scope, schedules, and resources.
• Communicate plans, status updates, next steps, and risks effectively.
• Steer package technology and design rules with input from team members.
• Collaborate with customers, vendors, and cross-functional teams.

• 12+ years of experience in flip-chip-BGA package design, including high-speed Ser Des.
• Minimum of 3 years in a management role.
• Bachelor's or Master's degree in Electrical Engineering or a similar field.
• Knowledge of package-level signal and power integrity.
• Self-management and organizational skills.
• Technical understanding of the package-design lifecycle, including.mcm, package spreadsheets, and drawings.

• Experience with layout, SI/PI extractions, and simulations.
• Automation code development skills.
• Mechanical and thermal modeling expertise.
• Proficiency in project management.
• Ability to understand skill sets and traits of team members to maximize productivity and retention.
• Experience with new business quotes, power integrity, and PCB layout.

This role requires working onsite five days a week, split between San Jose and Fort Collins locations. The work environment supports collaboration with a worldwide team across multiple time zones, requiring co-design with internal team members and external designers.

This is a Permanent position based out of Fort Collins, CO.

Pay and Benefits

The pay range for this position is $140000.00 - $240000.00/yr. Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors. As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth.

All subject to relevant plan documents and award agreements. Broadcom offers a competitive and comprehensive benefits package:
Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

This position is anticipated to close on Sep 4, 2026.