Mechanical Principal Engineer – AI Technologies

Mechanical Principal Engineer – AI Technologies

Mechanical Principal Engineer – AI Technologies

Thermal / Mechanical Engineering leads and delivers the development of innovative and compliant mechanical design solutions, as well as cross‑functional interfaces for datacenter and server computer systems and peripherals. Our team conducts the analysis, feasibility studies and testing of mechanical products, instruments, subassemblies and packaging for new and existing products – and then oversees the introduction of design changes to the manufacturing organizations.

Join us to do the best work of your career and make a profound social impact as a Mechanical Principal Engineer on our Mechanical Engineering Team in Austin, Texas or Franklin, Massachusetts.

This role is critical to enabling next‑generation AI and high‑density computing by ensuring reliable, efficient, and scalable thermal solutions. You will directly influence customer success and shape the future of data center cooling technologies.

• Serve as the technical subject matter expert (SME) for mechanical and thermal systems, with a focus on DLC technologies in customer environments
• Lead customer engagements, including design reviews, site readiness assessments, and deployment support for liquid‑cooled systems
• Collaborate with cross‑functional teams (electrical, systems, manufacturing, and field engineering) to ensure end‑to‑end thermal solution delivery; influence product design by incorporating customer feedback and field learnings into next‑generation solutions
• Analyze and optimize thermal performance of racks, servers, and cooling distribution units (CDUs) under real‑world operating conditions; develop and present technical documentation, whitepapers, and customer‑facing materials
• Support installation, commissioning, and troubleshooting of DLC systems, including manifolds, cold plates, and facility integration; provide root cause analysis and corrective actions for thermal or mechanical issues encountered during deployments

• Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or related field
• 5+ years of experience in thermal design, fluid dynamics, or data center cooling technologies
• Hands‑on experience with Direct Liquid Cooling (DLC) systems, including cold plates, fluid loops, and heat exchangers
• Strong understanding of heat transfer, CFD analysis, and fluid mechanics; experience working in customer‑facing or field engineering roles
• Ability to travel (up to 30–50%) for customer deployments and site support
• Experience with high‑performance computing (HPC), AI infrastructure, or GPU‑based systems; knowledge of coolant chemistry, reliability, and contamination control
• Familiarity with data center infrastructure, including chilled water systems and facility integration; proficiency in thermal simulation tools (e.g., ANSYS Icepak, Fluent, or similar)
• Strong communication skills with the ability to translate complex engineering concepts for customers and executives

Dell is committed to fair and equitable compensation practices. The salary range for this position is $145k - $187k.

Dell Technologies is committed to the principle of equal employment opportunity for all employees and to providing employees with a work environment free of discrimination and harassment. Read the full Equal Employment Opportunity Policy here.