Firmware Engineer

Sr. Firmware Engineer

Job Profile

Summary:

The Firmware Design Engineer is responsible for full lifecycle development of custom thermal control application firmware.

We are Boyd’s Thermal Test and Control Systems division, located in Phoenix, Arizona, developing innovative thermal test solutions for the semiconductor industry. We seek a talented Firmware Design Engineer to join our multi‑disciplined engineering team.

• Work with multi‑discipline team to develop thermal control products involving diverse custom thermal forcing hardware.
• Full lifecycle development of custom thermal control application firmware.
• Support proof‑of‑concept studies.
• Use tuning parameters to effect dynamic performance of feedback control systems.
• Maintain and enhance firmware on existing thermal products.
• Develop firmware using Qt/C++ for application development for Linux OS target and using C for non‑OS/bare‑metal targets.

• Bachelor’s degree or higher in Electrical Engineering, Computer Engineering, Computer Science or related technical field and 10+ years of related experience.
• 4+ years experience in embedded system programming in C or C++.
• Experience interfacing with common communication methods such as TCP/IP, and I2C, SPI, RS‑232.
• Experience interfacing with low‑level analog hardware via ADC, DAC, and PWM.
• Ability to understand schematics and IC operation and design low‑level drivers.

• Multi‑process/multi‑threaded design experience.
• Application programming experience on Linux‑based platforms (Debian preferred).
• User Interface programming experience (Qt, WebIQ preferred).
• Configuring and tuning feedback control loops (e.g., PID).
• Windows desktop app development experience for utilities (C#/Visual Studio or Qt preferred).

Boyd Corp is an equal‑opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.