Principal SI Design Engineer

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Molex is seeking a Principal Signal Integrity Design Engineer to join our Optical Solutions Business Unit (OSBU). In this role, the successful candidate will be part of a world‑class engineering team, contributing to the development of next‑generation Photonic Integrated Circuits (PICs). The successful candidate will be responsible for designing, implementing, and validating advanced RF interconnects for PICs, transceivers, and optical engines.

The Principal Signal Integrity Design Engineer will provide design support for existing and advanced photonic technology and collaborate with global, cross‑functional teams and supplier partners to develop next‑generation photonic solutions.

The PIC Components and Technology Development team are responsible for the research and development of advanced technology platforms and solutions for the next generation of optical connectivity in AI fabrics, data centers, and datacom applications. Reporting to the Director of Photonics Technology, you will be a key member of the team and will serve as the technical lead for developing advanced integrated RF interconnect technologies such as TSV and EPIC for 400G/L PAM4, CPO, and 1.6T/3.2T coherent products and will closely collaborate with the PIC component design, signal integrity, layout, test & reliability, and transceiver design teams as well as with external partners like semiconductor foundries, OSATs, CMs, and vendors.

This role can be based anywhere in the United States or Canada.

• Lead the R&D, design, and EVT/DVT activities with regards to developing advanced integrated RF interconnect solutions for 400G/L PAM4, CPO, and 1.6T/3.2T coherent products
• Collaborate with the SI/PI, opto‑mechanics, packaging, and test and reliability teams to provide appropriate test vehicles for EVT/DVT of advanced integrated RF interconnects
• Work with external partners, foundries, contract manufacturers, and OSATs to develop required processes and demonstrate production‑level performance, reliability, and quality
• Intimately collaborate with the SI/PI and transceiver design teams to build and validate predictive RF models for plug gables and transponders including external ASICs components such as DRV, TIA, DSP (LPO, LRO)
• Collaborate with the PIC component design and PDK teams in developing advanced modulator devices for the next generation of PIC products.
• Mentor other SI/PI engineers and cross‑functional groups on advanced EM simulation and design techniques based on commercial software tools and custom codes

• PhD typically in Electrical Engineering, Microwave Photonics, Physics or related technical fields
• At least 10 years of relevant industry experience in designing advanced RF interconnects and/or signal/power integrity for optical connectivity applications
• Expertise of Si and/or III‑V photonic integrated circuits (PICs)
• Experience with CMOS semiconductor and backend processes as well as packaging ecosystem
• Expert level user of commercial modeling tools such as Ansys HFSS, ADS, or equivalent software

For this role, we anticipate paying $200,000 - $300,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.