Packaging Engineer; ICs/Sensors
Listed on 2026-02-19
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Engineering
Manufacturing Engineer, Packaging Engineer, Quality Engineering, Mechanical Engineer -
Manufacturing / Production
Manufacturing Engineer, Packaging Engineer, Quality Engineering
Dice is the leading career destination for tech experts at every stage of their careers. Our client, Oxford Global Resources, is seeking the following. Apply via Dice today!
TitlePackaging Engineer
LocationOnsite in Fremont, CA
Duration6-12 months, Contract-to-Hire
Ideal Start3/2 or 3/9
Interview Process- MS Teams Video Call
- Onsite/Group MS Teams Interview
US Persons, Drug Test, & Background Check Required
ScopeOxford's client is in need of a packaging engineer to join their manufacturing team. They are looking for someone with a degree in Mechanical, Electrical, or Manufacturing to work on packaging for sensors (temperature, pressure, ICs, etc). This is not on the semiconductor fab side, but the post assembly of the dye. Their ideal candidate has a background in dye attach, wire bonding, gel fill, QFN, SOIC, etc.
Their packaging is primarily plastics and stainless steel. Candidates should know the assembly processes that go into manufacturing (soldering/laser welding, epoxy fill) and optimization of wire bond/dye attached. There will be some vacuum/leak testing as well. Experience with DOE & FMEA is critical. Being able to identify what can go wrong, where, how bad it could go, and what could be done to mitigate actions is also crucial.
- Packaging (ICs, sensors)
- Assembly Processes
- DOE
- FMEA
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