Field Service Engineer-Chinese Bilingual

Role Weighting

Process Engineering:
Approximately 10-20%

Field Service Engineering:
Approximately 80-90%

Key Responsibilities Field Service Engineering (Primary Responsibility) Equipment Installation & Maintenance

Support installation, setup, and qualification of backend equipment

Perform and support FAT/SAT and customer acceptance testing

Execute preventive and corrective maintenance as needed

Discussion about specification of modification of equipment in the field

Sales activities of maintenance parts Equipment Troubleshooting & Escalation Support

Diagnose mechanical, electrical, pneumatic, vacuum, and software issues of equipment, wafer handling robots, aligners, EFEM and new products that TAZMO Japan develops and markets in the future

Diagnose process‑induced tool issues and coordinate resolution

Support tool calibration, recipe setup, and tool matching

Documentation & Feedback

Prepare service reports, RCA documentation, and customer communications

Provide structured feedback to engineering teams for tool and process improvement

Propose maintenance contract

Prepare specification sheet of equipment

Process Engineering FOWLP Process Development & Optimization

Setup demo environment and an office in Arizona

Develop new businesses by conducting demonstrations

Develop, qualify, and optimize process, including Temporary carrier bonding and debonding Optimization of process Lead DOE, SPC analysis, and yield improvement initiatives Customer & Cross-Functional Technical Support

Serve as the primary technical interface for process-related topics

Support customer process integration, NPI, and ramp to HVM

Collaborate with product, equipment, quality, and R&D teams

Support customer technical reviews, audits, and escalations

Others

Other general duties are based on projects or particular assignments as needed

Required Qualifications Education

• Materials Science
• Electrical Engineering
• Chemical Engineering
• Mechanical Engineering

Experience

5–10 years of experience in:

• Semiconductor backend process engineering
• Advanced packaging or wafer‑level packaging environments

Hands‑on experience with FOWLP processes and manufacturing equipment

Technical Skills

Experience with:

• Backend process of semiconductor
• SPC, DOE, Cp/Cpk analysis
• Failure analysis and yield modeling
• Cleanroom and HVM environments

Ability to read and interpret:

• Electrical schematics
• Mechanical drawings
• Pneumatic and vacuum diagrams

Preferred Qualifications

• Experience supporting backend factories
• Knowledge of PLC
• Familiarity with power devices, AI/HPC packaging requirements
• Prior field service or customer‑facing engineering experience
• Knowledge of slit die coating

Soft Skills

• Strong analytical and structured problem‑solving skills
• Excellent customer‑facing communication abilities
• Ability to work independently at customer sites
• High level of ownership, accountability, and technical credibility
• Ability to communicate in traditional Chinese

Misc.

Ability to routinely lift, pull, or push objects, up to 50 pounds with or without accommodation

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