Packaging Process Development Engineer

Position summary

The Packaging Development Engineer will design, develop, qualify, and optimize packaging and assembly processes for semiconductor devices and sensors (including MEMS, ICs, ASICs, discrete sensors). This role leads prototype-to-production process development, reliability qualification, supplier development, and implementation into manufacturing. The engineer will balance electrical/mechanical/thermal performance, cost, manufacturability, and reliability to support Amphenol's product roadmaps.

Key responsibilities

Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation
Define manufacturing process flows, tooling, materials specifications, and control plans for prototypes and high-volume production.
Lead Design for Reliability/Manufacturing (DfX/DfM) reviews with product design, test, and manufacturing teams.
Create and execute DOE (design of experiments) to optimize process windows and yield; analyze results using statistical tools (e.g., Minitab/JMP).
Author and maintain process documentation: process sheets, work instructions, SPC/CPK reports, FMEA, PPAP/APQP packages (for automotive customers).
Partner with suppliers and contract manufacturers to qualify equipment, processes, materials (epoxies, solders, plating chemistries), and subcontractor processes; perform supplier audits as needed.
Plan and oversee reliability and environmental qualification testing (thermal cycling, HAST, temperature humidity bias, mechanical shock, vibration, solderability, thermal shock); interpret results and drive corrective actions.
Perform and coordinate failure analysis (SEM, X-ray/CT, C-SAM, cross-sectioning) and root-cause investigations.
Transfer processes to internal and external manufacturing sites where needed; support production ramps and troubleshoot yield/quality issues at manufacturing locations.
Ensure compliance with industry standards and customer requirements (JEDEC, IPC, ISO 9001/AS9100/IATF 16949 as applicable), plus RoHS/REACH and other regulatory needs.
Mentor junior engineers and technicians; present technical status to stakeholders and customers.

Required qualifications

BS in Materials/ Electrical/Mechanical Engineering (MS preferred), 3+ years in semiconductor or sensor packaging/process development
2+ years of hands-on experience in semiconductor or sensor packaging, assembly process development, or failure analysis.
Demonstrated experience with die attach, wire bonding, flip-chip, molding/encapsulation, soldering , singulation and metallization/plating processes.
Practical knowledge of reliability test protocols and failure-analysis techniques.
Strong statistical analysis skills and experience with DOE; comfortable using Minitab or JMP.
Experience preparing process documentation, FMEA, control plans, and PPAP/APQP packages (especially for automotive/aerospace customers).
Excellent written and verbal communication skills; strong cross-functional collaboration.

Preferred experience and skills

Familiarity with SEM, X-ray/CT, C-SAM, microsectioning, and metallographic microscopy.
Knowledge of ESD/cleanroom practices and contamination control.
Project management experience; PMP or Six Sigma certification a plus.
Prior experience working with suppliers across APAC/EMEA and supporting process transfer globally.

Technical tools & equipment (examples)

Software:
Minitab/JMP, Excel, Word, Powerpoint
Lab/process tools: wire bonders, flip-chip bonders, die bonders, reflow ovens, mold presses, plasma cleaning tools, , pick-and-place, X-ray/CT, SEM, C-SAM, environmental chambers for thermal/humidity testing.

Success metrics (KPIs)

Time-to-qualify new package/processes (target per product/project).
First-pass yield and overall manufacturing yield improvements.
Reliability pass rates vs. customer requirements.
Number and criticality of customer field failures attributable to packaging/process development .
Successful transfers to internal/external production sites within schedule and budget.
Cost-per-unit improvements from design/process optimization.

Working conditions & travel

Typical R&D/lab environment with occasional exposure to cleanroom and manufacturing floor.
Global travel to supplier sites, contract manufacturers, and customer locations as needed - typically up to 10-25%

Diversity, safety & compliance

Follow Amphenol's EHS and quality policies; contribute to a culture of safety and continuous improvement.
Support company diversity and inclusion initiatives.