Hardware Development Engineer; Wafer Optical Metrology

Job Description

We are seeking a highly motivated Wafer Optical Metrology Engineer to support advanced thin‑film magnetic read/write head manufacturing and process control initiatives. The engineer will be responsible for developing, optimizing, and sustaining optical metrology methodologies used in lithography and pattern alignment processes for wafer manufacturing. This role focuses on improving measurement robustness, accuracy, throughput, tool performance, process capability, and yield through data‑driven analysis and collaboration with process integration, lithography, and manufacturing teams.

• Develop, qualify, and maintain optical metrology recipes and measurement strategies for semiconductor wafer manufacturing processes.
• Analyze parametric data trends, identify process excursions, and implement corrective actions in collaboration with process, integration, and yield engineering teams.
• Perform statistical analysis and process capability studies (SPC, Cp/Cpk, regression analysis, DOE).
• Drive continuous improvement initiatives for precision, throughput, and automation.
• Develop scripts and data analysis tools using Python, JMP, or similar platforms.
• Generate technical reports, presentations, and documentation for engineering reviews.
• Support technology transfers and new process development for advanced products.
• Crosstrain within Metrology Engineering to build broad technical competence and provide support coverage across teams.

• B.S. or M.S. in Physics, Optics, Engineering (chemical, mechanical, electrical), or Material Science.
• 0–3 years of relevant work experience (internships, co‑ops, or academic research experience considered).
• Knowledge of statistical process control (SPC) and data analysis techniques.
• Detail‑oriented work habits with a willingness to learn and grow.
• Ability to manage assignments and meet deadlines with appropriate guidance.
• Willingness to work hands‑on with equipment and wafers in a clean room environment; prior clean room or wafer fabrication/processing experience is a plus.

• Understanding of optical overlay, alignment, critical dimension (CD), and defect metrology.
• Experience working in high‑volume manufacturing environments.
• Programming/scripting experience in Python, SQL, or JMP.

• Overlay metrology
• Semiconductor process control
• Lithography alignment
• Statistical analysis
• Root cause analysis
• Automation and scripting
• Technical communication

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WD is committed to providing equal opportunities to all applicants and employees and will not discriminate against any applicant or employee based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender‑related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disability, medical condition, genetic information, protected medical and family care leave, Civil Air Patrol status, military and veteran status, or other legally protected characteristics.

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Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through…