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Technical Program Manager - Hyperscale Rack & Cooling Solutions

Job in Fremont, Alameda County, California, 94537, USA
Listing for: Sanmina-SCI Systems de México
Full Time position
Listed on 2026-06-19
Job specializations:
  • Engineering
    Mechanical Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 85000 - 98000 USD Yearly USD 85000.00 98000.00 YEAR
Job Description & How to Apply Below

Technical Program Manager – Hyperscale Rack & Cooling Solutions - (107695) Location

Fremont, CA 94538 US (Primary)

Sanmina Corporation (Nasdaq: SANM) is a leading integrated manufacturing solutions provider serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina Corporation provides end-to-end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, defense and aerospace, industrial and semiconductor systems, medical, multimedia, computing and storage, automotive and clean technology sectors.

Sanmina Corporation has facilities strategically located in key regions throughout the world.

The Sanmina Fremont facility is a full-service enclosure systems solution manufacturing plant. Located in California’s Silicon Valley, this facility produces low-to-mid volume New Product Introduction (NPI) runs to full-scale volume. The Fremont facility offers everything from small piece parts to fully integrated and tested systems. Supporting diverse technology sectors including semiconductor, telecommunications, and medical equipment, the Fremont facility offers a wide array of services including sheet metal fabrication, welding, painting and clean room assembly.

Job

Purpose

Reporting to the Vice President of Business Operations, this position serves as the primary technical lead for the development and manufacturing of high-density IT rack systems. The role focuses on the structural integrity, mechanical precision, and thermal integration of OCP (Open Compute Project) and ORV3-compliant enclosures. The candidate acts as the bridge between hyperscale customer engineering and the manufacturing floor, ensuring that complex sheet metal designs are optimized for mass production.

Nature

of Duties/Responsibilities
  • Structural & Mechanical Liaison:
    Acts as the technical lead for rack frame development, translating customer mechanical specifications into high-volume fabrication processes.
  • Fabrication Strategy:
    Leads the DFM (Design for Manufacturing) process for complex sheet metal assemblies, ensuring rack frames meet stringent tolerances for EIA-310 and OCP standards.
  • Hyperscale Program Execution:
    Manages the end-to-end NPI (New Product Introduction) lifecycle, from initial CAD review and prototyping to full-scale production of frames, busbars, and internal shelving.
  • Cooling System Integration:
    Oversees the mechanical integration of liquid cooling components—including CDUs, manifolds, and dripless quick-disconnects—into the structural frame without compromising mechanical rigidity.
  • Prototyping & Validation:
    Manages the build and testing of structural prototypes, ensuring frames can support massive dynamic loads during shipping and data center deployment.
  • Supplier & Plant Coordination:
    Works directly with manufacturing plants to refine processes for laser cutting, robotic welding, and precision bending of high-strength steel and aluminum components.
  • Bid & Proposal Leadership:
    Technical lead for RFQs, providing cost‑benefit analysis on different fabrication methods (e.g., modular vs. welded frames) to ensure competitive pricing and structural performance.
  • Some travel may be required.
Education & Experience
  • Education:

    Bachelor’s Degree in Mechanical Engineering or a related technical discipline.
  • Mechanical Expertise: A minimum of 5 years of experience in Precision Sheet Metal Fabrication. Must have a deep understanding of metal behavior, including bend deductions, welding distortion, and structural stress points.
  • Rack Architecture:
    Direct experience with IT rack frames. Understanding of "Cold Aisle/Hot Aisle" containment and structural requirements for AI/GPU‑heavy deployments is highly preferred.
  • Cooling Integration:
    Experience integrating liquid cooling hardware (manifolds, tray‑level plumbing) into mechanical enclosures.
  • Manufacturing IQ:
    Deep proficiency in fabrication processes: CNC turret punching, fiber laser cutting, press brake forming, and advanced finishing (powder coating and plating).
  • Software Proficiency:
    Advanced skill in Solid Works or similar…
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