Probe Process Engineer

• Job Type (exemption status):
  Exempt position - Please see related compensation & benefits details below
• Salary Range:
  
  -
• Business Function:
  Hardware Development
• Work Location:
  
  Fremont Office--_USCA
  13

WD is building the infrastructure behind the AI-driven data economy.

As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time. That’s where we come in.

We combine deep engineering expertise with global-scale manufacturing to deliver the storage systems that make AI possible, powering hyperscale data centers, cloud platforms, and enterprise infrastructure worldwide.

This isn’t theoretical work. It’s real systems, at real scale, people solving some of the hardest challenges in technology today.

We’re looking for people who want to build, solve, and operate at that level.

Join us and let’s shape the future of data.

The Process Engineer will support wafer probe operations for both product development and high-volume manufacturing environments. This role is responsible for developing, sustaining, and optimizing wafer probe processes, test methodologies, SPC systems, probe card configurations, and test setup infrastructure. The engineer will work closely with Test Engineering, Product Development, Yield Engineering, Manufacturing, and Operations teams to ensure robust process control, measurement integrity, and successful new product introductions.

Essential Duties and Responsibilities:

Develop, qualify, and sustain wafer probe processes for new and existing products, including probe recipes, operating specifications, setup requirements, and engineering controls across both product development and high-volume manufacturing environments.

Define, validate, and maintain probe card configurations and wafer test setups, supporting qualifications, releases, maintenance strategies, and change management to ensure test readiness for engineering builds, qualifications, and production ramps.

Monitor and optimize process performance using SPC, EDC, and statistical analysis; develop and maintain control limits, OCAPs, screening methodologies, and engineering dashboards to ensure measurement integrity and data accuracy.

Investigate process excursions and implement data-driven corrective actions through characterization studies, gauge capability evaluations, and tool correlation analyses to improve yield, quality, and cycle time.

Lead wafer probe readiness for New Product Introductions (NPI), defining product-specific test plans, specifications, and qualification strategies while coordinating cross-functional activities to ensure seamless transfer from development to high-volume manufacturing.

Drive continuous improvement initiatives targeting yield enhancement, cycle time reduction, productivity gains, process simplification, measurement system improvements, and equipment utilization optimization.

Partner with Test Engineering, Product Engineering, Yield Engineering, Manufacturing, Operations, Quality, and IT teams to provide technical leadership in root cause analysis, corrective action implementation, engineering reviews, and documentation of best practices and knowledge transfer materials.

• BS/MS in Electrical Engineering, Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or related discipline.
• Experience in semiconductor manufacturing, wafer probe engineering, or test engineering.
• Demonstrated proficiency in electrical measurement techniques with hands‑on experience in laboratory and cleanroom environments.
• Strong understanding of statistical process control (SPC), design of experiments (DOE), and semiconductor test methodologies.
• Proficiency with data analysis…