Solderer

Summary

Perform a variety of assembly operations on electronic components and subassemblies on the production line utilizing work process procedures, written instructions, diagrams, and specifications. Primary work is conducted under a lighted magnified lens, utilizing small hand tools, machinery and applicable materials, while soldering components and assembling to printed circuit boards utilizing a soldering iron.

• Read and interpret assembly instructions, drawings and work instruction processes.
• Identify hardware, wire assemblies, metal, plastic, and other components.
• Complete written tests for ESD and soldering requirements, IPC-A-610 Class 3, and J-STD-001 certification.
• Handle through‑hole components, fine‑pitch capacitors, resistors, SMT and other pick‑and‑place components, BGA assemblies, FR‑4 PCBs, mechanical assemblies, and hybrids.
• Utilize tools such as tweezers, fine‑pitch tools, calipers, gauges, scales, wire strippers, and multimeters.
• Probe capacitors and resistors with a multimeter to verify value/capacitance.
• Use insert assembly machines to install inserts on PCBs and housings.
• Depanel and clean PCBA’s.
• Bend leads per IPC‑A-610 Class 3, J‑STD‑001, Mil‑STD, and drawing requirements.
• Use high‑temperature solder pots for lead soldering and tinning of component leads and hybrids.
• Solder through‑hole components and hybrids on FR‑4 PCBs using soldering irons, conforming to IPC‑A-610 Class 3, J‑STD‑001, and Mil‑STD.
• Use hot‑air guns and tweezers to remove and rework PCBs, following IPC standards.
• Clean PCBs post‑soldering using isopropyl alcohol.
• Possibly pour chemicals for conformal coating, sealing, or encapsulation of PCBs and sub‑assemblies.
• Inspect components and PCBs for defects before starting and after finishing the assembly.
• Adhere to all ESD requirements and board handling procedures.
• Complete all in‑house training as specified in the job‑specific family or training plan.
• Follow company 6S and continuous improvement (kaizen) objectives.
• Perform any other duties as assigned.

• Perform general physical activities.
• Monitor processes, materials, and surroundings.
• Experience soldering per J‑STD‑001 and IPC‑A‑610 class 3 requirements.
• Familiarity with wiring color‑coding systems used in through‑hole electronics.
• Ability to work effectively on a team.
• Ability to access documents using a computer.
• Sense of urgency; meets deadlines consistently.
• Mechanical aptitude, dexterity, and ability to lift up to 20 lbs.
• Fluency in English (reading, writing, and speaking).

• High school diploma, GED, or equivalent experience.
• Valid U.S. permanent residency or U.S. citizenship.

Due to ITAR and/or CUI compliance, this position requires candidates to be a U.S. citizen or U.S. permanent resident alien.

Comprehensive benefit package including medical, dental, and vision coverage; company‑paid basic life/AD&D insurance; short‑term and long‑term disability insurance; voluntary supplemental insurances; flexible spending accounts; and an employee assistance program (EAP). Sick leave, vacation time, and company‑paid holidays are also provided as paid time off. NEOTech offers a 401(k) retirement savings plan with a company match.

NEOTech is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including sexual orientation and gender identity), national origin, disability, protected veteran status, or any other characteristic protected by applicable federal, state, or local law.

Candidates considered for hire must pass a pre‑employment background check and drug test screening for illegal drugs and marijuana.