Postdoctoral Fellow; PREP

PREP Research Associate (CHIPS Funded Project)

Position located in the Infrastructure Materials Group, National Institute of Standards and Technology (NIST), in collaboration with Johns Hopkins University. This role is part of the NIST Professional Research Experience (PREP) program and supports the CHIPS initiative.

• Develop finite element models of thermomechanical behavior of heterogeneous multilayered systems.
• Characterize degradation of materials and interfaces before, during, and after accelerated laboratory aging.
• Develop reliability models for complex advanced packaging systems.
• Provide technical leadership on finite element modeling of failure mechanisms in multilayered polymeric structures.
• Disseminate research results through presentations at conferences, publication of journal papers, and technical reports.

• U.S. citizenship preferred.
• Currently live in the United States.
• Ph.D. in Physics, Mechanical Engineering, Electrical Engineering, Materials Science, or Chemical Engineering.
• Experience in nano- and micro-scale mechanical testing and materials characterization.
• Experience in finite element modeling of heterogeneous systems.
• Experience in advanced semiconductor packaging is preferred.
• Strong oral and written communication skills.

$82,000 - $87,000.

Job is suitable for people of all ages, sexes, genders, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status, or other legally protected characteristics. Educational, training, and experience are the primary criteria used to evaluate candidates.