Postdoctoral Fellow; PREP

Overview

PREP Research Associate – CHIPS Funded Project

This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. NIST recognizes that its research staff may wish to collaborate with researchers at academic institutions on specific projects of mutual interest, and thus requires that such institutions be the recipient of a PREP award. The PREP program requires staff from a wide range of backgrounds to work on scientific research in many areas.

Employees in this position will perform technical work that underpins the scientific research of the collaboration.

Research

Title:

Modeling and Mechanical Testing for Heterogenous Structures of Advanced Semiconductor Packaging.

The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a researcher with extensive expertise in finite element analysis and knowledge of instrumented mechanical testing, adhesion testing, polymer degradation characterization, and material damage analysis and modeling.

If selected, you will play a significant role in modeling and reliability testing of advanced chip packaging and other electronics applications, including setting up models to predict behavior, investigate potential failure points, identify crucial material parameters, plan and execute experimental research, and evaluate changes after aging. The results will be used to understand root causes of multilayer failures, providing a basis for test method development, material selection, and product quality assurance for the semiconductor industry.

• Develop finite element models of thermomechanical behavior of heterogeneous multilayered systems.
• Characterize the degradation of materials and interfaces before, during, and after exposure to accelerated laboratory aging.
• Develop reliability models for complex advanced packaging systems.
• Provide technical leadership on finite element modeling of failure mechanisms in multilayered polymeric structures.
• Disseminate research results through presentations at conferences, publication of journal papers, and technical reports.

• U.S. citizenship is preferred.
• Currently live in the United States.
• Ph.D. in Physics, Mechanical Engineering, Electrical Engineering, Materials Science, or Chemical Engineering.
• Experience in nano- and micro-scale mechanical testing and materials characterization.
• Experience in finite element modeling of heterogeneous systems.
• Experience in advanced semiconductor packaging is preferred.
• Strong oral and written communication skills.

The Johns Hopkins University is committed to equal opportunity for its faculty, staff, and students. The university does not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status or other legally protected characteristics. The university is committed to providing qualified individuals access to all academic and employment programs, benefits and activities on the basis of demonstrated ability, performance and merit without regard to personal factors that are irrelevant to the program involved.