Postdoctoral Fellow; PREP

This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program and focuses on advancing reliability testing and failure analysis for advanced semiconductor packaging within CHIPS-funded projects.

Reliability Testing and Failure Analysis for Advanced Semiconductor Packaging

• Develop and validate new test methods for multilayer adhesion in advanced packaging assemblies.
• Characterize the thermal and mechanical properties of materials and interfaces before, during, and after accelerated aging.
• Conduct in‑situ environmental digital image correlation (DIC) to quantify package/assembly deformation during thermal cycling.
• Develop advanced failure‑analysis methods using microscopic and X‑ray‑based techniques for complex package structures.
• Perform finite element analysis to simulate package deformation/warpage under thermo‑mechanical loading, informing the development of more accurate reliability models.
• Create comprehensive datasets of material and interface properties, both pre‑ and post‑aging, to support reliability modeling.
• Communicate results through conference presentations, peer‑reviewed publications, and technical reports.

• Live in the United States.
• Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, Chemical Engineering, or Chemistry.
• Strong oral and written communication skills.
• Experience in polymeric thin film adhesion.
• Experience in advanced semiconductor packaging is preferred.
• U.S. citizenship is preferred.

The Johns Hopkins University is committed to equal opportunity and does not discriminate on the basis of any legally protected characteristics.