Postdoctoral Fellow (PREP0004280

PREP Research Associate

Salary: $70,000 - $89,000

Metrology of Materials, Surfaces, and Processes for Semiconductor Advanced Packaging

• Design, model, and performance of test methods to evaluate bond quality of bonded chip pairs using different wafer materials and bond methods.
• Design and fabrication of test rigs for bond strength measurement.
• Implement bond strength testing at cryogenic and high temperatures.
• Closely coordinate with teams performing materials characterization, surface and thin film characterization.

• PhD in mechanical engineering, physics, electrical engineering, materials science, or a related field.
• Experience with wafer and/or hybrid chip bonding processes.
• Experience with destructive test methods, such as those utilizing materials test machines or related instruments.
• Proficiency in finite element modeling, using tools such as COMSOL or ANSYS.
• Proficiency in CAD, using tools such as Solid Works or Autodesk.
• Proficiency in programming languages, such as Python, Java, or Matlab.
• Excellent communication skills and ability to work effectively in a team.
• Experience, including process development, in back-end semiconductor device fabrication, including wafer cleaning and handling (desirable).
• Familiarity with silicon electronic and photonic device processing (desirable).
• Experience with custom infrared microscopy and optical measurement setups (desirable).
• US citizenship strongly preferred (desirable).

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