Postdoctoral Fellow; PREP

PREP Research Associate CHIPS Funded Project

This position is part of the National Institute of Standards and Technology (NIST) Professional Research Experience Program (PREP). NIST recognizes that its research staff may want to collaborate with researchers at academic institutions on specific projects of mutual interest and, therefore, requires those institutions to be recipients of a PREP award. The PREP program involves staff from a wide range of backgrounds conducting scientific research across various fields.

Individuals in this position will perform technical work supporting the collaboration's scientific research.

Research

Title:

Numerical modeling for nano-to-microscale thermo-mechanical measurements (U.S. Citizens Preferred)

The Materials Measurement Laboratory of the National Institute of Standards and Technology is seeking qualified persons (U.S. Citizens Preferred) to perform finite element analysis and simulations related to nanoscale and microscale material property measurements based on atomic force microscopy and instrumented indentation. This work will focus primarily on numerical modeling of nanoscale and microscale thermomechanical tests on materials and heterogeneous structures used in advanced packaging of microelectronics.

• Perform finite element analyses to model the thermo-mechanical behavior of materials and structures at the micro- and nano-scale.
• Research and develop theoretical models for the analysis of temperature-dependent micro/nanomechanical behavior of materials and heterogeneous structures at elevated temperatures. As needed, refine these models based on data from AFM and nanoindentation experiments.
• Publish results in peer-reviewed scientific journals and present results at scientific conferences.

• PhD in Materials Science or related field.
• Advanced knowledge and experience with finite element methods/multiscale modelling, particularly related to nano/microscale contact mechanics. Experience writing software and/or using python scripting to speed up/automate simulation workflows.
• Experience with computational materials research, particularly in the validation of experimental results or extraction of materials properties from complex experimental data.
• Knowledge of AFM and/or nanoindentation experiments. Hands on experience preferred.
• Knowledge of materials commonly used in BEOL layers and interconnects of microelectronic devices, particularly those used in hybrid bonding processes.
• Strong written and oral communication skills; ability to work independently and as part of a team.

Please upload the following with your application:

• CV/Resume (Please limit CV to 3 pages only and include a valid email address for your contact info. Your resume will not be considered if the following information is included on your CV/resume.)
• Self portraits
• Phone number
• Home address/Country
• Citizenship status
• Languages spoken
• Sex/Gender

The referenced salary range represents the minimum and maximum salaries for this position and is based on Johns Hopkins University’s good faith belief at the time of posting. Not all candidates will be eligible for the upper end of the salary range. The actual compensation offered to the selected candidate may vary and will ultimately depend on multiple factors, which may include the successful candidate’s geographic location, skills, work experience, internal equity, market conditions, education/training and other factors, as reasonably determined by the University.

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