Senior Signal Integrity Engineer

Your Job

Designs, develops, and coordinates the design and production of high‑speed multigigabit connectors, test boards, and laboratory testing from inception to completion. You will own measurement‑simulation correlation efforts, create and validate electromagnetic and circuit models, and deliver reliable test hardware and data that enable product design decisions across package, PCB, and silicon teams.

Designs, develops, and coordinates the design and production of high‑speed multigigabit connectors, test boards, and laboratory testing from inception to completion. You will own measurement‑simulation correlation efforts, create and validate electromagnetic and circuit models, and deliver reliable test hardware and data that enable product design decisions across package, PCB, and silicon teams.

You will join a multidisciplinary signal‑integrity engineering group that supports package, PCB, and silicon design teams. The group focuses on measurement‑driven modeling, high‑speed interconnect design, and developing best practices for multigigabit serial links and validation methods.

• Lead end‑to‑end development of high‑speed connectors and test boards, translating system requirements into validated measurement and simulation outcomes.
• Create accurate electromagnetic and circuit models, run simulations, and drive correlation with lab measurements to reduce risk in product designs.
• Design and prototype test fixtures and measurement setups that enable repeatable, manufacturable characterization of high‑speed links.
• Synthesize measurement findings into actionable recommendations that improve connector/board designs, simulation practices, and design documentation.
• Collaborate across package, PCB, and silicon teams to integrate findings into product roadmaps and ensure measurement evidence supports design decisions.

• Bachelor’s degree in engineering or physics from an accredited four‑year college or university.
• 3+ years of related experience in high‑speed interconnect design, test engineering, or equivalent combination of education and experience.
• Working knowledge of transmission‑line and electromagnetic‑field theory as applied to multigigabit Ser Des links.
• Hands‑on experience with VNA and TDR measurements and experience using MATLAB and SPICE‑based tools for analysis.
• Practical experience using electromagnetic field solvers (e.g., Ansys HFSS or CST) and PCB/mechanical design tools (e.g., Altium, Solid Works, Creo).

• Experience with Ansys HFSS advanced features, Ansys Q3D, SIwave, CST Microwave Studio, and Agilent/Keysight ADS.
• Prior work with PCIe, Fiber Channel, Infini Band, Ethernet, or other high‑speed interface standards and related compliance testing.
• Familiarity with MIL/Aero specifications and rigorous qualification environments.
• Demonstrated success in measurement‑simulation correlation projects and improving modeling best practices.
• Strong technical writing and presentation skills for conveying complex measurement and modeling results to engineering and management audiences.

At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location.

If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.

All Koch companies value diversity of thought, perspectives, aptitudes, experiences, and backgrounds. We are Military Ready and Second Chance employers. Learn more about our hiring philosophy here.

As a leader in aerospace and defense electronics, Molex - ADS, is a leader committed to engineering and manufacturing excellence. With a legacy of over six decades, we take pride in our team of passionate and skilled professionals who play a pivotal role in developing and manufacturing…