Senior Process Engineer - Deposition

Summary

Atomicais seeking adriven

Process Engineer to join our Surface Engineering, with a primary focusondeposition. We are looking for someone who cansupportexistingproduction processes and develop processes fornewprograms(20+)focusingonproductqualityand manufacturability. Collaboration isa mustas you work closely with the integration, manufacturing engineering, maintenance and production teams on development of new processes, selectionof new equipment/technology, standardizationand problem resolution. This role is designed for a technical leader who thrives at the intersection of advanced materials and complex vacuum hardware.

• End-to-End Development: Design and execute recipes for new thin-film applications, ensuring strict adherence to required material properties (mechanical, optical and electrical characteristics).
• Integration
  
  Collaboration:
  
  Partner with the integration team to ensure surface engineering solutions meet functional requirements for complex devices.
• Tool
  
  Qualification:
  
  Lead the technical evaluation, installation, and testing of new capital equipment to meet production-ready standards.
• DOE & Optimization: Design and execute Design of Experiments (DOE) to determine process windows and optimize results. Strong fundamentals in data analysis and demonstrated critical thinking skills.

• Early-Stage & Production Support: Identify and resolve fundamental process instabilities during early-stage R&D while maintaining the discipline to lead "Task Force" efforts for chronic production excursions.
• Hardware-Process Mastery: Act as the primary technical expert for resolving complex process‑hardware interactions.
• Tool Troubleshooting: Help perform diagnostics on vacuum systems, RF power delivery, and gas flow controllers. Hands‑on experience is highly valued.

• Statistical Process Control (SPC): Implement and monitor SPC charts in JMP to identify trends, prevent excursions, and ensure long‑term process stability.
• Standardization: Author and maintain high‑quality Standard Operating Procedures and technical documentation to ensure cross‑shift consistency.

• PVD: Experience with RF, DC, and Pulsed DC Magnetron Sputtering, Ion Beam Deposition (IBD) and E‑beam evaporation.
• CVD & ALD: Deep knowledge of PECVD, HDPCVD, ALD, and LPCVD.
• Thermal: Proficiency in oxidation furnaces, annealing, and RTP/RTA.

• Plasma Processing: Hands‑on experience with Bosch process (DRIE), dielectric etching, plasmaashing, and Ion Beam Etching (IBE).

• B.S., M.S., or Ph.D. in Materials Science, Electrical Engineering, Physics, or other engineering discipline.
• 5+ years of experience in a semiconductor microfabrication manufacturing environment.
• Deep understanding of material properties and the specific process knobs required to obtain them.
• Expert‑level proficiency in JMP for data analysis, statistical modeling, and DOE.
• Proven track record of "hands‑on" hardware troubleshooting. Ability to diagnose mechanical, electrical, and vacuum‑related failures.