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Senior Manager Mechanical Engineering

Job in Goleta, Santa Barbara County, California, 93116, USA
Listing for: Raytheon
Full Time position
Listed on 2026-06-06
Job specializations:
  • Engineering
    Systems Engineer, Mechanical Engineer, Electronics Engineer, Engineering Design & Technologists
Salary/Wage Range or Industry Benchmark: 125000 - 150000 USD Yearly USD 125000.00 150000.00 YEAR
Job Description & How to Apply Below

Title: Senior Manager, Mechanical Engineering

Location: 6380 Hollister Ave, Goleta, CA (US-CA-GOLETA-H01)

Position type: Onsite

Security Clearance: DoD Secret, U.S. citizenship required. Ability to obtain and maintain a U.S. government issued security clearance is required.

About the Role

Raytheon’s Vision Systems and Electronic Warfare Center is seeking a Senior Manager, Mechanical Engineering to lead and manage a talented team of 12–15 mechanical engineers. The section specializes in the design, integration, verification, and production of digital processors and RF receiver subsystems for airborne platforms. Key interfaces will be with other sections across the department, other engineering disciplines, as well as internal and external customers.

Occasional travel (10–20%) may be required to other Raytheon facilities and suppliers or customer sites.

What You Will Do
  • Responsible for direct line management for the engineers in the section including career and performance development, mentoring, training, tool and process development, resource allocation, and championing the use of established procedures, processes and instructions.
  • Key technical contributor to the programs and products supported by the section.
  • Serve as a liaison to the programs, ensuring program success along technical, cost and schedule parameters, as well as overseeing section member job assignments, performance, and recognition.
  • Participate in bid and proposal efforts and share in other cross‑functional SM responsibilities.
  • Possess working knowledge of electronics packaging design and manufacturing including knowledge/experience with thermal and structural design and analysis, electrical component design, construction and failure modes, printed wiring board and circuit card assembly processes and best practices, surface mount installation processes and failure modes, metal fabrication and finishing methods, RF isolation mechanical design, and environmental test methods and equipment.
  • Have working knowledge of electronics/processor systems design and development utilizing COTS/MOTS components and products.
Qualifications You Must Have
  • Experience leading mechanical design, development and/or implementation of defense‑related electronic systems with demonstrated ability to meet program objectives, including serving as a subsystem lead, REA, IPTL, or similar technical authority role.
  • Experience designing and developing electronics packaging solutions for high‑reliability systems including supporting hardware through environmental qualifications (e.g., vibration, shock, thermal) and product delivery.
  • Experience applying Geometric Dimension Tolerance (GD&T) and American Society of Mechanical Engineers (ASME) drawing standards to production hardware.
  • Experience with 3D solid modeling tools (Creo/Pro/Engineer or similar) for mechanical design and documentation.
  • Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 10 years of prior relevant experience or an advanced degree in a related field and minimum 7 years’ experience.
Qualifications We Prefer
  • Experience as a people manager with a successful track record building effective teams including hiring and personnel development, cross‑functional collaboration, teamwork, decision making, adaptability, morale building and strengthening team dynamics.
  • Experience in all phases of the engineering lifecycle including bidding, design, implementation, delivery, EVMS or comparable earned value management system and associated engineering tracking and metrics.
  • Electronic Warfare (EW), radar, RF subsystems, or airborne electronics Thermal and structural analysis methods for electronics hardware using FEA modeling techniques.
  • CCA/PCB integration, cabling and harness design, or RF isolation features.
  • Design reviews (PDR, CDR, TRR) and presenting technical data to customers.
  • Proposals, including Basis of Estimates (BOEs) or technical volume leadership and contributions.
  • Root cause investigations and corrective actions in production environments.
  • Parts Management and Materials and Process Engineering.
  • Demonstrated skills and success in handling a fast paced and dynamic…
Position Requirements
10+ Years work experience
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