Principal Semiconductor Product Engineer

Role Overview

Focal Plane Operations at Raytheon Vision Systems is seeking a Principal Semiconductor Product Engineer with semiconductor wafer processing, team stakeholder and project management knowledge. The candidate will work within a multi-discipline team to develop advanced Sensor Chip Assemblies (SCAs) utilizing single and dual color Hg Cd Te /HCT, III/V (InSb, In Ga As , SLS, nBn and others) semiconductors or advanced micro‑bolometer (uncooled) detector technologies.

This may include detector design, process development, manufacture and test of SCAs at the RVS Goleta wafer/SCA fabrication facility.

• Lead the development and execution of strategic initiatives for advanced infrared semiconductor technologies, ensuring alignment with organizational goals and program objectives.
• Manage cross‑functional teams, working closely with Integrated Product Team Leads, Program Managers, and key stakeholders to ensure technical requirements are defined, risks/opportunities are managed, and schedules/budgets are met.
• Provide expert‑level guidance in the design, process development, manufacturing, and testing of single and dual color Hg Cd Te /HCT, III/V (In Ga As , SLS, nBn, and others) semiconductors or advanced micro‑bolometer (uncooled) detector technologies.
• Serve as a thought leader in the organization, driving technical innovations and presenting high‑level technical analysis to Engineering and Program Review Boards.
• Oversee and contribute to the development of advanced statistical methodologies, including Design of Experiments (DoE) and Statistical Process Control (SPC), to optimize semiconductor device performance and manufacturing yields.
• Prepare and present comprehensive technical justification analysis reports to internal and external stakeholders, including senior leadership and customers.

• Degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 10 years of prior relevant experience.
• Experience in Semiconductor Engineering, Manufacturing Engineering, Process Engineering, Engineering product management and/or Wafer Processing.

• Deep expertise in Hg Cd Te , III/V semiconductor or micro‑bolometer (uncooled) detector physics, wafer processing in a cleanroom environment.
• Proven ability to analyze and interpret data related to semiconductor device performance, with a strong foundation in statistical methods and process optimization.
• Demonstrated experience in leading Design of Experiments (DoE) and Statistical Process Control (SPC) programs.
• Strong understanding of process yields, root‑cause analysis, and continuous improvement methodologies.
• Hands‑on experience with the use and implementation of device design and modeling tools such as MATLAB.
• Familiarity with Bids and Proposals processes and Earned Value Management Systems (EVMS).
• Exceptional communication and leadership skills with the ability to influence and guide strategic decision‑making.

Salary range: 145,600 USD – 276,800 USD.

• Medical, dental, vision, life insurance, short‑term disability, long‑term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays.
• Potential eligibility for annual short‑term and/or long‑term incentive compensation programs.
• U.S.
  
  -based role; appropriate pay structure and benefits apply for U.S. territory residents.

RTX is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability or veteran status, or any other applicable state or federal protected class. RTX provides affirmative action in employment for qualified Individuals with a Disability and Protected Veterans in compliance with Section 503 of the Rehabilitation Act and the Vietnam Era Veterans’ Readjustment Assistance Act.