Senior Mechanical Engineer
Listed on 2026-07-27
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Engineering
Mechanical Engineer, Systems Engineer, Electronics Engineer, Engineering Design & Technologists
Date Posted: Country:
United States of America
Location:
US-CA-GOLETA-H01 ~ 6380 Hollister Ave ~ BLDG H01 Position Role Type:
Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements:
The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance Security Clearance Type:
DoD Clearance:
Secret Security Clearance Status:
Active and existing security clearance required after day 1
At RTX, the world's largest aerospace and defense company, 185,000 great minds are united by purpose and inspired to make a difference solving the world’s most complex problems. With our three market leading businesses, world-class operations and investments in research and development, we offer capabilities and opportunity no one else can. Together, we push the boundaries of known science and find new ways to connect and protect our world.
Raytheon brings the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. We deliver solutions that help our nation and allies defend freedom and deter aggression, creating a safer, more secure world. Join us and help shape the future of aerospace and defense. Raytheon is seeking a Senior Mechanical Engineer to play a key role in new product development and enhancements within the Electronic Warfare Mechanical Design Hardware Section.
The section specializes in the design, integration, verification, and production of digital processors and RF receiver subsystems for airborne platforms. You will participate in the mechanical development and enhancements for supporting a variety of programs in Goleta, California. Key interfaces will be with other sections across the department, other engineering disciplines, as well as internal customers leading the supporting programs.
You Will Do
Participate in designing RF systems for challenging thermal and high vibration environments. May lead programs as a Responsible Engineering Authority (REA) or Integrated Product Team Lead (ITPL), and serve as a liaison to programs, ensuring program success as well as overseeing junior engineer’s job assignments and performance. Work with electronics packaging design. This may include, but is not limited to, thermal and structural design and analysis, electrical component design, construction and failure modes, printed wiring board and circuit card assembly processes and best practices, surface mount and through hole component installation processes and failure modes, metal fabrication and finishing methods, RF isolation mechanical design, and environmental test methods and equipment.
Occasional travel to other Raytheon facilities, suppliers or customer sites.
You Must Have Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 5 years of prior relevant experience or an advanced degree in a related field and minimum 3 years’ experience. Experience with Geometric Dimensioning and Tolerancing (GD&T) and ASME drawing and documentation standards and procedures. Mechanical engineering experience spanning the product development lifecycle including detailed design, packaging, manufacturing support, hardware integration and testing.
Experience with solid modeling, creating and documenting mechanical designs in CREO or similar modeling tools.
EW/Radar Systems or RF Products. Structural and thermal analysis using FEA modeling techniques. Conformal Antenna Array Packaging. Electronics packaging, cabling and harness design, and printed wiring board designs and routing. Managing budget and schedule (Earned Value Management (EVM)). Design reviews include preparation of chart decks, generating design artifacts and presenting to customers. Leader of a technical team including Integrated Product Team Lead (IPTL), Mechanical or Hardware Lead.
Developing Basis of Estimate (BOEs) for proposals and providing proposal technical volume leadership. Parts Management and Materials and Process Engineering. COTS / MOTS…
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