Semiconductor Process Engineer - E2
Listed on 2026-08-25
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Engineering
Process Engineer, Quality Engineering, Materials Engineering, Manufacturing Engineer
Standard Job Description
Develops new or sustaining process formulations using semiconductor device and component theory and design, materials, and products. Assignments include the definition of processing and handling product requirements and specifications, review of processing yields, throughput, and trends applied in the manufacture, fabrication, and evaluation of semiconductors. Typically responsible for projects or portions of projects for process definition, fabrication, modification and evaluation of semiconductor devices and components.
Standard Job Description
Develops new or sustaining process formulations using semiconductor device and component theory and design, materials, and products. Assignments include the definition of processing and handling product requirements and specifications, review of processing yields, throughput, and trends applied in the manufacture, fabrication, and evaluation of semiconductors. Typically responsible for projects or portions of projects for process definition, fabrication, modification and evaluation of semiconductor devices and components.
YourResponsibilities Will Include, But Are Not Limited To
- Assist in driving requirements and ownership across photolithography, etching, deposition, metrology, hybridization, advanced interconnects, and packaging processes.
- Develop and sustain compound detector products using data‑driven analysis.
- Lead continuous‑improvement initiatives to enhance process performance and yield.
- Collaborate with cross‑functional teams to integrate advanced interconnects and packaging solutions.
Education:
Bachelor’s degree in Materials, Material Science, Mechanical Engineering or Similar Engineering discipline
Minimum 2 Years of Experience related to Manufacturing Engineering Disciplines (Product/Process/Operations/Quality)
Experience in either photolithography, etching, deposition, metrology, hybridization, advanced interconnects, and packaging processes.
Familiarity with Microsoft Office Suite of Products (Word, Excel, PowerPoint)
Excellent written/oral communication, strong problem‑solving/root‑cause analysis, cross‑functional collaboration.
Desired SkillsExperience in semiconductor manufacturing
Ability to run failure analysis
Familiarity to DOE analysis
Experience running semiconductor equipment
Pay InformationFull-Time Salary Range: $91200.00 - $169400.00
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The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.
Benefits offeredMedical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k) match, Paid time off, Holidays, Parental Leave, EAP, Flexible Spending Accounts, Education Assistance, Life Insurance, Short-Term Disability, and Long-Term Disability.
- Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.
- For (Washington state applicants only) Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays.
PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.
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