Package Design Engineer

Staff Package Design Engineer

Quintessent Inc. San Francisco Bay Area

Build the laser platform that powers the next generation of AI infrastructure.

Quintessent is taking on some of the hardest challenges in optical connectivity – directly

attacking the foundational bottlenecks limiting the scalability and reliability of next-generation AI

and computing infrastructure. Our team has trail blazed pioneering work in quantum dot lasers

and amplifiers, heterogeneous integration, and multi-wavelength silicon photonics. We are

converging innovations in materials science, process integration, chip and system design to

build products that we believe will form a core part of AI networking systems.

We are a scrappy, high-trust team that takes ownership, stays humble, and believes in tackling

hard problems with speed, intellectual honesty, and relentless improvement. We hold ourselves

to a high bar, start from a deep understanding of our customers’ problems, and win or lose

together. If this sounds like you, and you want to build the laser and electronics platform that powers the next generation of AI infrastructure, we’d love to talk.

We are looking for a staff package design engineer to build the next generation of pluggable optical interconnects for Scale-Up and Scale-Out Data Center Interconnect Products

You will be the technical authority developing firmware for products, responsible for:

Developing packages for Silicon Photonics and Electronics components. Ability to generate the design internally, and work with various packaging houses to deliver/test production devices.

Your work will directly shape the products that ship and the capabilities the company builds.

• B.S or M.S. In Electrical/Mechanical/Materials engineering.
• Experience should cover various package designs for volume productions.
• Design expertise should cover capturing the design from layout tools and working with various packaging design houses for implementation.
• Thermal, mechanical, SI/PI, knowledge of the package design is essential. Experience in working on multichip design using silicon interposer is an asset.
• Ability to qualify the package for volume production is expected, data center parts, automotive parts, pluggable optics, qualification is an asset. Ability to work very closely with package vendors and OSAT is expected.

• Signal Integrity and/or Thermal simulations experience
• Supported high-volume production
• Worked directly with customers or partners

For more questions or to apply for the position, contact:

• Seniority level Mid-Senior level
• Employment type
  
  Full-time
• Job function Engineering and Information Technology
• Industries Computer Networking Products