ElectroMechanical Design Engineer Sr Stf: MicroElectronics

You will be the Electro Mechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles &Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high-performance thermal management technologies to create next generation electronic systems for aerospace and defense missions.

• Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets.
• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
• Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
• Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
• Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
• Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.

We offer flexible work schedules and comprehensive benefits, providing resources and flexibility to enable inspiration and focus.

This position is in Orlando, FL or Grand Prairie, TX.

MUST BE A U.S. CITIZEN. This position is located at a facility that requires special access; the selected candidate must be able to obtain a secret clearance.

• Experience with cable harness concepts for subsystem interfaces, generating wiring diagrams.
• Experience in circuit card assembly (CCA) / printed wiring board (PWB) design.
• Familiarity with high-speed applications and PWB constraints.
• Experience capturing flowed and derived requirements for electromechanical designs.

• Familiarity with SOC / MCP solutions and ASIC verification and validation testing needs at the circuit card level.
• Experience with parts and materials selections.
• Ability to perform design trade studies; evaluating cost, weight, packaging, power benefits.
• Familiarity with CAMEO.
• Experience with flex circuit design.
• Micro electronics design experience.

Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.