ElectroMechanical Design Engineer Sr. (Packaging Design

You will be the Senior Electromechanical Design Engineer for the Missiles & Fire Control (MFC) Hardware Engineering team. Our team designs, develops and manufactures precision engagement aerospace and defense systems for the United States and allied forces, delivering cutting‑edge electronic packaging, prototype hardware, and production‑ready solutions.

• Leading electromechanical hardware development on one or more defense programs while collaborating with senior leadership, production, quality and customer partners.
• Guiding hardware teams from concept through production to ensure on‑time, high‑quality delivery.
• Designing electromechanical systems for missile and radar electronics, including CCA/PWB packaging, harnesses, and enclosures.
• Creating detailed 3‑D models, 2‑D drawings, and layouts; selecting materials, components and manufacturing processes that meet size, weight, power and environmental limits.
• Acting as a Material Review Board (MRB) authority, making informed technical decisions and driving issue resolution.
• Defining acceptance test criteria, executing verification tests and documenting results for each hardware iteration.
• Performing thermal, shock, vibration and EMI analyses to satisfy flight qualification standards.
• Supporting program planning and partnering with senior management, production, quality and customers to meet cost, schedule and technical requirements.
• Mentoring junior engineers and fostering cross‑functional integration.
• Maintaining configuration control and design documentation in Lockheed Martin PLM tools (Windchill, Creo).
• Contributing to technical reviews and independent research and development (IRAD) initiatives.

• Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university;
  Master’s degree preferred.
• Minimum 3 years of professional experience in Electromechanical Engineering or related discipline.
• Experience with Creo and Windchill or equivalent CAD and PLM tools.
• Experience with MFC circuit card and printed wiring board packaging design.
• Experience with Technical Data Package generation, including BOM creation in Windchill, 2‑D drawings, and 3‑D modeling.
• Working knowledge of GD&T (Geometric Dimensioning and Tolerancing).
• Excellent communication and interpersonal skills.
• Experience working with defense customers.
• Team management experience.
• Must be a U.S. citizen; must possess or be able to obtain a DoD Secret security clearance.

• Prior knowledge of MFC programs.
• IRAD to LRIP transition experience.
• Experience working with production and quality teams.
• Experience with electronics, machined components, test equipment, and circuit cards.
• Experience with Windchill PDM (Product Data Management).
• Experience with military and aerospace specifications.
• Ability to manage multiple assignments/programs.
• Experience with Microsoft Office (Excel, Word, PowerPoint) and AutoCAD.
• Experience designing electronics packaging for Flight Termination Systems.
• Knowledge of Design Assurance processes.
• Flex circuit design experience.
• Active DoD Secret or Top Secret Clearance.

This position requires a government security clearance; you must be a U.S. citizen for consideration.

Lockheed Martin is an equal‑opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.

Experience Level: Experienced Professional

Business Unit: MISSILES AND FIRE CONTROL

Relocation Available: Possible

Career Area: Electrical Engineering

Type: Full‑Time

Shift: First