Circuit Card Design Engineer Sr

You will be the Circuit Card Design Engineer for the Hardware Engineering team at Lockheed Martin Missiles and Fire Control (MFC). Our team creates, prototypes and fields high reliability circuit card assemblies (CCAs) that power missiles, sensors and other mission critical defense systems for the United States and allied militaries.

• Drive architecture, schematic capture and EPCAD layout for CCAs that support missile and sensor subsystems.
• Define, refine and document system, performance, interface and environmental requirements for each design.
• Conduct trade study analyses of alternate design approaches and recommend the optimal implementation.
• Perform circuit simulation and analysis using CadencePSpice (or equivalent) to verify functionality and margins.
• Capture schematics in Siemens Xpedition Enterprise and collaborate with EPCAD to produce robust layout and signal routing solutions.
• Own the complete design assurance package—delivering all data, evidence and compliance reports for senior review.
• Coordinate with systems, electromechanical, firmware/software and manufacturing teams to guarantee seamless integration and testing.
• Manage bill of materials, part sourcing and prototype build up activities, driving cost effective parts selection.
• Verify compliance with shock, vibration, radiation and other environmental qualification standards.

This position is in Dallas.

We offer flexible work schedules and comprehensive benefits investing in your future and security.

Part‑time remote telework: employee will work part of their schedule remotely and part at a Lockheed Martin facility.

Schedule:

4x10 hour day, 3 days off per week. Standard 40‑hour week and other condensed schedules available.

• Bachelor of Science degree in Electrical Engineering or a closely related STEM field from an accredited university;
  Master’s degree preferred.
• Minimum 3 years of professional experience in circuit design engineering or a related discipline.
• Demonstrated experience with circuit card design, integration, and test for one or more of the following: digital electronics, power electronics, analog/mixed‑signal, or FPGA‑based processor boards.
• Experience with Siemens Xpedition Enterprise or equivalent for schematic capture.
• Must be a U.S. Citizen; must possess or be able to obtain a DoD Secret security clearance.

• Experience with MFC circuit card design processes and the Design Assurance process.
• Experience with Xilinx/AMD FPGA families (Ultra Scale, Versal).
• Experience with Mixed signal design.
• Experience with MOSA (Modular Open Systems Architecture) and WOSA (Weapon Open Systems Architecture).
• Experience with rigidflex circuit card design.
• Experience with environmental qualification testing (vibration, shock, thermal, radiation).
• Demonstrated effective communication skills.

Must be a U.S. Citizen and able to obtain a DoD Secret clearance; a company‑sponsored interim Secret clearance is required to start.