ElectroMechanical Packaging Engineer; Hardware Protection Focus

Position: ElectroMechanical Packaging Engineer (Hardware Protection Focus)
Requisition  Eligible?:
Yes

ERP amount: N/ARelocation:
Possible Type:
Exempt

Shift: 1

Clearance Prior to Start:
None Final Clearance:
Secret Pay Transparency: $ - $Experience Level: Experienced Professional FT/PT/Casual:
Full Time Department : MFC-Primary Business Unit: MFC-Primary Standard

Job Description You will be the Electro Mechanical Engineer for the Hardware Engineering team at Lockheed Martin  Missiles and Fire Control (MFC). Our team delivers precision engagement aerospace and defense systems, designing, building and fielding the electrical hardware that powers missiles, sensors and other mission critical subsystems for the United States and allied militaries.

What You Will Be Doing As the Electro Mechanical Engineer, you will have ownership of package hardware design, heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed 3

DHI packages throughout their operational lifespans. Your responsibilities will include
• Design multichip package devices, including package substrates, Integrated Heat Spreaders and attach mechanism, stiffeners, and complex thermal management system integration to manage high thermal dissipation requirements.
• Collaborate with mechanical and electrical engineering analysts to develop advanced Finite Element Analysis (FEA) to perform Multiphysics models and simulations for thermal cycling and reliability, power integrity and electrical performance, and  mechanical stress including operation shock and vibration.
• Define and execute packaging qualification plans adhering to project requirements, JEDEC and MIL-SPEC standardizations (e.g., Highly Accelerated Stress Testing / HAST).
• Investigate and perform failure analysis loops on critical component interface and intermetallic connections including anomalies like cracked solder joints, delaminated layers, and warped package substrates.  Implement corrective actions to mitigate identified failure modes in manufacturing and incorporate findings into product revisions while capturing lessons learned for future development activity.
• Architecting, designing, and validating advanced circuit card packages
• Designing high-density circuit cards, cable assemblies, and interconnect solutions that meet size, weight, power, security, and performance constraints
• Designing and developing electromechanical systems for advanced programs, special programs, and IRAD programs, including printed wiring boards, circuit/electronic card assemblies, harness assemblies, and sub-assemblies
• Leading and documenting design assurance reviews, tracking issues, and driving corrective actions to closure
• Performing thermal, signal integrity, and electromagnetic compatibility analyses to ensure robust operation in harsh DoD environments
• Coordinating with cross-functional teams — systems, hardware, software, test, and supply chain — to deliver high-quality results on schedule and within budget
• Managing risk, schedule, and earned value metrics, and reporting status to senior leadership

Why Join UsDo you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules to comprehensive benefits investing in your future and security. Learn more about Lockheed Martin’s comprehensive benefits package here.

Further Information About This Opportunity:

This position is in Orlando, FL. Discover more about our Orlando, Florida location.

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