Detector​/Instrument Engineer; Sr

Overview

Must be a US Person or Permanent Resident

W2 with full benefits

Customer and contract specific training will be required and provided.

Location - Greenbelt, MD (GSFC)

Offer contingent on ability to successfully pass a background check and drug screen

Senior Detector/Instrument Engineer Oversees and directs activities associated with detector/instrument engineering.

The Columbus Technologies & Services at NASA Goddard Space Flight Center seeks a talented microfabrication engineer to advance our cutting‑edge technology for internal projects. This exciting opportunity allows you to contribute directly to next‑generation space exploration capabilities.

Job Responsibilities includes:

• Develop and optimize microfabrication processes for MEMS devices
• Troubleshoot process issues and implement solutions
• Collaborate with cross‑functional teams in design, test, and integration
• Document procedures and results according to industry standards
• Contribute to continuous improvement initiatives for fabrication processes

Plans and implements detector/instrument engineering studies, analyses, and development in support of flight, airborne, and ground mechanical and electrical hardware including all scientific and support software required to operate and/or test the associated equipment and/or facility.

This position requires a Bachelor of Science degree in Electrical Engineering, Physics, or Computer Science from an accredited institution or have equivalent education in a different field and experience.

This position requires 8 years of experience with an interdisciplinary background in the development of aerospace hardware. A minimum of 5 years of flight detector/instrument hardware/software development experience is also required.

• Bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or related field; MS or PhD preferred
• Minimum 3 years of hands‑on experience in semiconductor or MEMS fabrication environments
• Demonstrated expertise in photolithography processes including photoresist application, exposure systems, such as stepper tools or E‑beam lithography, and pattern development
• Comprehensive knowledge of thin film deposition methods including:
• Physical vapor deposition (thermal/e‑beam evaporation and sputtering)
• Chemical vapor deposition (PECVD)
• Thermal oxidation processes
• Atomic Layer Deposition (ALD)
• Proficiency in etching techniques including:
• Wet chemical etching of metals and dielectric films
• Plasma‑based dry etching (RIE)
• Deep Reactive Ion Etching (DRIE)
• Specialty vapor phase etching (vapor HF and XeF2)
• Experience operating metrology and characterization equipment including:
• Optical and electron microscopy
• Ellipsometry for film thickness measurement
• Stress measurement techniques for thin films
• Electrical probing and device characterization

• Cleanroom experience in class 10-1000 environments
• Familiarity with process integration and optimization
• Experience with Design of Experiments methodology
• Knowledge of MEMS design principles and fabrication challenges